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</html><thumbnail_url>https://www.engineernewsnetwork.com/blog/wp-content/uploads/2020/08/congatec-conga-x7eval-connectors.jpg</thumbnail_url><thumbnail_width>1000</thumbnail_width><thumbnail_height>750</thumbnail_height><description>As the embedded electronics world eagerly awaits the release of the new Computer on Module (COM) standard, COM for High Performance Computing (COM HPC), Martin Frederiksen reflects on how its predecessor, the COM Express Type 7, will continue to impact on baseboard designs in telecoms for many years to come&nbsp; The UK&#x2019;s telecoms market is &hellip;</description></oembed>
