{"id":14627,"date":"2019-11-08T08:00:33","date_gmt":"2019-11-08T08:00:33","guid":{"rendered":"https:\/\/www.engineernewsnetwork.com\/blog\/?p=14627"},"modified":"2019-11-05T18:18:40","modified_gmt":"2019-11-05T18:18:40","slug":"development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology","status":"publish","type":"post","link":"https:\/\/www.engineernewsnetwork.com\/blog\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\/","title":{"rendered":"Development kit enables engineers to evaluate possibilities of F-RAM memory technology"},"content":{"rendered":"\n<p>RS Components (RS) has announced it is shipping a new easy-to-use and inexpensive development kit that will enable engineers to evaluate the high-performance Excelon Ultra QSPI F-RAM memory technology from Cypress Semiconductor.<\/p>\n\n\n\n<p>There are demanding requirements for robust memory performance in terms of cycling endurance and data retention for industrial systems operating in harsh environments.&nbsp;<\/p>\n\n\n\n<p>Combining non-volatile data storage, fast write speed and 100 trillion cycle write endurance, F-RAM memory technology enables systems to instantly capture, log, and retain sensor data and system-state information in the event of power loss.<\/p>\n\n\n\n<p>Cypress\u2019 advanced Excelon F-RAM technology is well suited for deployment in a variety of industrial applications including industrial automation, data logging, motor control, programmable logic controllers, point-of-sale, test and measurement, and smart meters.<\/p>\n\n\n\n<p>The main board of the <strong><a href=\"https:\/\/uk.rs-online.com\/web\/c\/semiconductors\/semiconductor-development-kits\/memory-development-kits\/?applied-dimensions=4291307429\" target=\"_blank\" rel=\"noreferrer noopener\" aria-label=\" (opens in a new tab)\">CY15FRAMKIT-002<\/a><\/strong> development kit integrates a 4-Mbit (512Kx8) Excelon-Ultra Quad-SPI F-RAM.&nbsp;<\/p>\n\n\n\n<p>Offering an operating voltage range from 1.8V to 3.6V, the board supports efficient low pin-count, high-speed interfaces. <\/p>\n\n\n\n<p>The board has Morpho headers for SPI- and QSPI-mode operation, which also enables evaluation using the ST NUCLEO-L433RC-P microcontroller evaluation board. In addition, the board works with any Arduino UNO R3 compatible boards for SPI mode operation.<\/p>\n\n\n\n<p>Additional features of the board include an \u201340 to +85\u02daC industrial-grade operating range; hardware protection with a write-protect pin; software block protection; and embedded ECC (Error-Correcting Code).<\/p>\n\n\n\n<p>The Cypress CY15FRAMKIT-002 F-RAM development kit is shipping now from RS in the EMEA and Asia Pacific regions.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>RS Components (RS) has announced it is shipping a new easy-to-use and inexpensive development kit that will enable engineers to evaluate the high-performance Excelon Ultra QSPI F-RAM memory technology from Cypress Semiconductor. There are demanding requirements for robust memory performance in terms of cycling endurance and data retention for industrial systems operating in harsh environments.&nbsp; &hellip;<\/p>\n","protected":false},"author":1,"featured_media":14628,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[104],"tags":[],"class_list":["post-14627","post","type-post","status-publish","format-standard","has-post-thumbnail","","category-electronics"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Development kit enables engineers to evaluate possibilities of F-RAM memory technology - Engineer News Network<\/title>\n<meta name=\"description\" content=\"RS Components has announced it is shipping a new easy-to-use and inexpensive development kit that will enable engineers to evaluate the high-performance Excelon Ultra QSPI F-RAM memory technology from Cypress Semiconductor\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.engineernewsnetwork.com\/blog\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\/\" \/>\n<meta property=\"og:locale\" content=\"en_GB\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Development kit enables engineers to evaluate possibilities of F-RAM memory technology - Engineer News Network\" \/>\n<meta property=\"og:description\" content=\"RS Components has announced it is shipping a new easy-to-use and inexpensive development kit that will enable engineers to evaluate the high-performance Excelon Ultra QSPI F-RAM memory technology from Cypress Semiconductor\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.engineernewsnetwork.com\/blog\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\/\" \/>\n<meta property=\"og:site_name\" content=\"Engineer News Network\" \/>\n<meta property=\"article:published_time\" content=\"2019-11-08T08:00:33+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2019\/11\/RS911-Cypress_F-RAM_kit.png\" \/>\n\t<meta property=\"og:image:width\" content=\"700\" \/>\n\t<meta property=\"og:image:height\" content=\"540\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/png\" \/>\n<meta name=\"author\" content=\"admin\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"admin\" \/>\n\t<meta name=\"twitter:label2\" content=\"Estimated reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\\\/\"},\"author\":{\"name\":\"admin\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#\\\/schema\\\/person\\\/4477342aea8e299c6a21761e513ea8e1\"},\"headline\":\"Development kit enables engineers to evaluate possibilities of F-RAM memory technology\",\"datePublished\":\"2019-11-08T08:00:33+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\\\/\"},\"wordCount\":251,\"image\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/wp-content\\\/uploads\\\/2019\\\/11\\\/RS911-Cypress_F-RAM_kit.png\",\"articleSection\":[\"Electronics\"],\"inLanguage\":\"en-GB\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\\\/\",\"url\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\\\/\",\"name\":\"Development kit enables engineers to evaluate possibilities of F-RAM memory technology - Engineer News Network\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/wp-content\\\/uploads\\\/2019\\\/11\\\/RS911-Cypress_F-RAM_kit.png\",\"datePublished\":\"2019-11-08T08:00:33+00:00\",\"author\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#\\\/schema\\\/person\\\/4477342aea8e299c6a21761e513ea8e1\"},\"description\":\"RS Components has announced it is shipping a new easy-to-use and inexpensive development kit that will enable engineers to evaluate the high-performance Excelon Ultra QSPI F-RAM memory technology from Cypress Semiconductor\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\\\/#breadcrumb\"},\"inLanguage\":\"en-GB\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-GB\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\\\/#primaryimage\",\"url\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/wp-content\\\/uploads\\\/2019\\\/11\\\/RS911-Cypress_F-RAM_kit.png\",\"contentUrl\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/wp-content\\\/uploads\\\/2019\\\/11\\\/RS911-Cypress_F-RAM_kit.png\",\"width\":700,\"height\":540,\"caption\":\"RS Components introduces advanced F-RAM development board from Cypress Semiconductor\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Development kit enables engineers to evaluate possibilities of F-RAM memory technology\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#website\",\"url\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/\",\"name\":\"Engineer News Network\",\"description\":\"The ultimate online news and information resource for today's engineer\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-GB\"},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#\\\/schema\\\/person\\\/4477342aea8e299c6a21761e513ea8e1\",\"name\":\"admin\",\"url\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/author\\\/admin\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Development kit enables engineers to evaluate possibilities of F-RAM memory technology - Engineer News Network","description":"RS Components has announced it is shipping a new easy-to-use and inexpensive development kit that will enable engineers to evaluate the high-performance Excelon Ultra QSPI F-RAM memory technology from Cypress Semiconductor","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.engineernewsnetwork.com\/blog\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\/","og_locale":"en_GB","og_type":"article","og_title":"Development kit enables engineers to evaluate possibilities of F-RAM memory technology - Engineer News Network","og_description":"RS Components has announced it is shipping a new easy-to-use and inexpensive development kit that will enable engineers to evaluate the high-performance Excelon Ultra QSPI F-RAM memory technology from Cypress Semiconductor","og_url":"https:\/\/www.engineernewsnetwork.com\/blog\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\/","og_site_name":"Engineer News Network","article_published_time":"2019-11-08T08:00:33+00:00","og_image":[{"width":700,"height":540,"url":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2019\/11\/RS911-Cypress_F-RAM_kit.png","type":"image\/png"}],"author":"admin","twitter_card":"summary_large_image","twitter_misc":{"Written by":"admin","Estimated reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\/#article","isPartOf":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\/"},"author":{"name":"admin","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#\/schema\/person\/4477342aea8e299c6a21761e513ea8e1"},"headline":"Development kit enables engineers to evaluate possibilities of F-RAM memory technology","datePublished":"2019-11-08T08:00:33+00:00","mainEntityOfPage":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\/"},"wordCount":251,"image":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\/#primaryimage"},"thumbnailUrl":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2019\/11\/RS911-Cypress_F-RAM_kit.png","articleSection":["Electronics"],"inLanguage":"en-GB"},{"@type":"WebPage","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\/","url":"https:\/\/www.engineernewsnetwork.com\/blog\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\/","name":"Development kit enables engineers to evaluate possibilities of F-RAM memory technology - Engineer News Network","isPartOf":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\/#primaryimage"},"image":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\/#primaryimage"},"thumbnailUrl":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2019\/11\/RS911-Cypress_F-RAM_kit.png","datePublished":"2019-11-08T08:00:33+00:00","author":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#\/schema\/person\/4477342aea8e299c6a21761e513ea8e1"},"description":"RS Components has announced it is shipping a new easy-to-use and inexpensive development kit that will enable engineers to evaluate the high-performance Excelon Ultra QSPI F-RAM memory technology from Cypress Semiconductor","breadcrumb":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\/#breadcrumb"},"inLanguage":"en-GB","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.engineernewsnetwork.com\/blog\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\/"]}]},{"@type":"ImageObject","inLanguage":"en-GB","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\/#primaryimage","url":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2019\/11\/RS911-Cypress_F-RAM_kit.png","contentUrl":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2019\/11\/RS911-Cypress_F-RAM_kit.png","width":700,"height":540,"caption":"RS Components introduces advanced F-RAM development board from Cypress Semiconductor"},{"@type":"BreadcrumbList","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/development-kit-enables-engineers-to-evaluate-possibilities-of-f-ram-memory-technology\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.engineernewsnetwork.com\/blog\/"},{"@type":"ListItem","position":2,"name":"Development kit enables engineers to evaluate possibilities of F-RAM memory technology"}]},{"@type":"WebSite","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#website","url":"https:\/\/www.engineernewsnetwork.com\/blog\/","name":"Engineer News Network","description":"The ultimate online news and information resource for today's engineer","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.engineernewsnetwork.com\/blog\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-GB"},{"@type":"Person","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#\/schema\/person\/4477342aea8e299c6a21761e513ea8e1","name":"admin","url":"https:\/\/www.engineernewsnetwork.com\/blog\/author\/admin\/"}]}},"_links":{"self":[{"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/posts\/14627","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/comments?post=14627"}],"version-history":[{"count":3,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/posts\/14627\/revisions"}],"predecessor-version":[{"id":14632,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/posts\/14627\/revisions\/14632"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/media\/14628"}],"wp:attachment":[{"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/media?parent=14627"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/categories?post=14627"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/tags?post=14627"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}