{"id":1679,"date":"2017-10-10T18:40:51","date_gmt":"2017-10-10T17:40:51","guid":{"rendered":"https:\/\/engineernewsnetwork.com\/blog\/?p=1679"},"modified":"2017-10-10T18:40:51","modified_gmt":"2017-10-10T17:40:51","slug":"high-speed-communication-in-automotive-applications","status":"publish","type":"post","link":"https:\/\/www.engineernewsnetwork.com\/blog\/high-speed-communication-in-automotive-applications\/","title":{"rendered":"High speed communication in automotive applications"},"content":{"rendered":"<span class=\"highlight highlight-blue\"><a href=\"http:\/\/www.toshiba.semicon-storage.com\" target=\"_blank\" rel=\"noopener\">Toshiba Electronics Europe<\/a><\/span> has unveiled the TLX9310, a low power consumption photocoupler housed in a 5-pin 3.7mm x 7.0mm x 2.2mm SO6 package.<\/p>\n<p>The new device is intended for high-speed communication in automotive applications, especially Battery Management Systems (BMS).<br \/>\n<script async src=\"\/\/pagead2.googlesyndication.com\/pagead\/js\/adsbygoogle.js\"><\/script><br \/>\n<ins class=\"adsbygoogle\" style=\"display: block; text-align: center;\" data-ad-format=\"fluid\" data-ad-layout=\"in-article\" data-ad-client=\"ca-pub-7565662001938327\" data-ad-slot=\"7585079586\"><\/ins><br \/>\n<script>\n(adsbygoogle = window.adsbygoogle || []).push({});\n<\/script><br \/>\nIntegration of a high-power infrared LED and high-gain, high-speed photo IC chip reduces power consumption to below 25% of <span class=\"highlight highlight-blue\"><a href=\"https:\/\/engineernewsnetwork.com\/blog\/toshibas-so6l-package-ic-photocouplers-now-have-option-for-wide-leadform\/\" target=\"_blank\" rel=\"noopener\">Toshiba<\/a><\/span>\u2019s current devices (TLX9304, TLX9376, TLX9378) both during standby and active use in automotive applications. Supply current is just 0.3mA.<\/p>\n<p>The TLX9310 provides high levels of safety isolation with 5.0mm (min.) creepage \/ clearance distances and a 3.75kVrms (min.) isolation voltage.<\/p>\n<p>The low propagation delay of 250ns (max.) permits use in high-speed communication systems.<\/p>\n<p>The operating temperature range of -40\u00b0C to +105\u00b0C makes the photocoupler ideal for demanding automotive applications.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Toshiba Electronics Europe has unveiled the TLX9310, a low power consumption photocoupler housed in a 5-pin 3.7mm x 7.0mm x 2.2mm SO6 package. The new device is intended for high-speed communication in automotive applications, especially Battery Management Systems (BMS). Integration of a high-power infrared LED and high-gain, high-speed photo IC chip reduces power consumption to &hellip;<\/p>\n","protected":false},"author":1,"featured_media":1680,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[104],"tags":[121,450,451,94],"class_list":["post-1679","post","type-post","status-publish","format-standard","has-post-thumbnail","","category-electronics","tag-automotive","tag-photocoupler","tag-tlx9310","tag-toshiba"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>High speed communication in automotive applications - Engineer News Network<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.engineernewsnetwork.com\/blog\/high-speed-communication-in-automotive-applications\/\" \/>\n<meta property=\"og:locale\" content=\"en_GB\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"High speed communication in automotive applications - Engineer News Network\" \/>\n<meta property=\"og:description\" content=\"Toshiba Electronics Europe has unveiled the TLX9310, a low power consumption photocoupler housed in a 5-pin 3.7mm x 7.0mm x 2.2mm SO6 package. The new device is intended for high-speed communication in automotive applications, especially Battery Management Systems (BMS). Integration of a high-power infrared LED and high-gain, high-speed photo IC chip reduces power consumption to &hellip;\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.engineernewsnetwork.com\/blog\/high-speed-communication-in-automotive-applications\/\" \/>\n<meta property=\"og:site_name\" content=\"Engineer News Network\" \/>\n<meta property=\"article:published_time\" content=\"2017-10-10T17:40:51+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2017\/10\/7046_HRES-1024x731.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1024\" \/>\n\t<meta property=\"og:image:height\" content=\"731\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"admin\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"admin\" \/>\n\t<meta name=\"twitter:label2\" content=\"Estimated reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/high-speed-communication-in-automotive-applications\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/high-speed-communication-in-automotive-applications\\\/\"},\"author\":{\"name\":\"admin\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#\\\/schema\\\/person\\\/4477342aea8e299c6a21761e513ea8e1\"},\"headline\":\"High speed communication in automotive applications\",\"datePublished\":\"2017-10-10T17:40:51+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/high-speed-communication-in-automotive-applications\\\/\"},\"wordCount\":142,\"commentCount\":0,\"image\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/high-speed-communication-in-automotive-applications\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/wp-content\\\/uploads\\\/2017\\\/10\\\/7046_HRES.jpg\",\"keywords\":[\"automotive\",\"Photocoupler\",\"TLX9310\",\"Toshiba\"],\"articleSection\":[\"Electronics\"],\"inLanguage\":\"en-GB\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/high-speed-communication-in-automotive-applications\\\/#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/high-speed-communication-in-automotive-applications\\\/\",\"url\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/high-speed-communication-in-automotive-applications\\\/\",\"name\":\"High speed communication in automotive applications - Engineer News Network\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/high-speed-communication-in-automotive-applications\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/high-speed-communication-in-automotive-applications\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/wp-content\\\/uploads\\\/2017\\\/10\\\/7046_HRES.jpg\",\"datePublished\":\"2017-10-10T17:40:51+00:00\",\"author\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#\\\/schema\\\/person\\\/4477342aea8e299c6a21761e513ea8e1\"},\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/high-speed-communication-in-automotive-applications\\\/#breadcrumb\"},\"inLanguage\":\"en-GB\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/high-speed-communication-in-automotive-applications\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-GB\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/high-speed-communication-in-automotive-applications\\\/#primaryimage\",\"url\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/wp-content\\\/uploads\\\/2017\\\/10\\\/7046_HRES.jpg\",\"contentUrl\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/wp-content\\\/uploads\\\/2017\\\/10\\\/7046_HRES.jpg\",\"width\":2100,\"height\":1500},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/high-speed-communication-in-automotive-applications\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"High speed communication in automotive applications\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#website\",\"url\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/\",\"name\":\"Engineer News Network\",\"description\":\"The ultimate online news and information resource for today's engineer\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-GB\"},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#\\\/schema\\\/person\\\/4477342aea8e299c6a21761e513ea8e1\",\"name\":\"admin\",\"url\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/author\\\/admin\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"High speed communication in automotive applications - Engineer News Network","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.engineernewsnetwork.com\/blog\/high-speed-communication-in-automotive-applications\/","og_locale":"en_GB","og_type":"article","og_title":"High speed communication in automotive applications - Engineer News Network","og_description":"Toshiba Electronics Europe has unveiled the TLX9310, a low power consumption photocoupler housed in a 5-pin 3.7mm x 7.0mm x 2.2mm SO6 package. The new device is intended for high-speed communication in automotive applications, especially Battery Management Systems (BMS). Integration of a high-power infrared LED and high-gain, high-speed photo IC chip reduces power consumption to &hellip;","og_url":"https:\/\/www.engineernewsnetwork.com\/blog\/high-speed-communication-in-automotive-applications\/","og_site_name":"Engineer News Network","article_published_time":"2017-10-10T17:40:51+00:00","og_image":[{"width":1024,"height":731,"url":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2017\/10\/7046_HRES-1024x731.jpg","type":"image\/jpeg"}],"author":"admin","twitter_card":"summary_large_image","twitter_misc":{"Written by":"admin","Estimated reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/high-speed-communication-in-automotive-applications\/#article","isPartOf":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/high-speed-communication-in-automotive-applications\/"},"author":{"name":"admin","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#\/schema\/person\/4477342aea8e299c6a21761e513ea8e1"},"headline":"High speed communication in automotive applications","datePublished":"2017-10-10T17:40:51+00:00","mainEntityOfPage":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/high-speed-communication-in-automotive-applications\/"},"wordCount":142,"commentCount":0,"image":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/high-speed-communication-in-automotive-applications\/#primaryimage"},"thumbnailUrl":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2017\/10\/7046_HRES.jpg","keywords":["automotive","Photocoupler","TLX9310","Toshiba"],"articleSection":["Electronics"],"inLanguage":"en-GB","potentialAction":[{"@type":"CommentAction","name":"Comment","target":["https:\/\/www.engineernewsnetwork.com\/blog\/high-speed-communication-in-automotive-applications\/#respond"]}]},{"@type":"WebPage","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/high-speed-communication-in-automotive-applications\/","url":"https:\/\/www.engineernewsnetwork.com\/blog\/high-speed-communication-in-automotive-applications\/","name":"High speed communication in automotive applications - Engineer News Network","isPartOf":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/high-speed-communication-in-automotive-applications\/#primaryimage"},"image":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/high-speed-communication-in-automotive-applications\/#primaryimage"},"thumbnailUrl":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2017\/10\/7046_HRES.jpg","datePublished":"2017-10-10T17:40:51+00:00","author":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#\/schema\/person\/4477342aea8e299c6a21761e513ea8e1"},"breadcrumb":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/high-speed-communication-in-automotive-applications\/#breadcrumb"},"inLanguage":"en-GB","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.engineernewsnetwork.com\/blog\/high-speed-communication-in-automotive-applications\/"]}]},{"@type":"ImageObject","inLanguage":"en-GB","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/high-speed-communication-in-automotive-applications\/#primaryimage","url":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2017\/10\/7046_HRES.jpg","contentUrl":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2017\/10\/7046_HRES.jpg","width":2100,"height":1500},{"@type":"BreadcrumbList","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/high-speed-communication-in-automotive-applications\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.engineernewsnetwork.com\/blog\/"},{"@type":"ListItem","position":2,"name":"High speed communication in automotive applications"}]},{"@type":"WebSite","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#website","url":"https:\/\/www.engineernewsnetwork.com\/blog\/","name":"Engineer News Network","description":"The ultimate online news and information resource for today's engineer","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.engineernewsnetwork.com\/blog\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-GB"},{"@type":"Person","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#\/schema\/person\/4477342aea8e299c6a21761e513ea8e1","name":"admin","url":"https:\/\/www.engineernewsnetwork.com\/blog\/author\/admin\/"}]}},"_links":{"self":[{"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/posts\/1679","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/comments?post=1679"}],"version-history":[{"count":2,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/posts\/1679\/revisions"}],"predecessor-version":[{"id":1682,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/posts\/1679\/revisions\/1682"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/media\/1680"}],"wp:attachment":[{"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/media?parent=1679"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/categories?post=1679"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/tags?post=1679"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}