{"id":19068,"date":"2021-02-24T10:30:00","date_gmt":"2021-02-24T10:30:00","guid":{"rendered":"https:\/\/www.engineernewsnetwork.com\/blog\/?p=19068"},"modified":"2021-02-23T10:45:19","modified_gmt":"2021-02-23T10:45:19","slug":"embedded-world-2021","status":"publish","type":"post","link":"https:\/\/www.engineernewsnetwork.com\/blog\/embedded-world-2021\/","title":{"rendered":"Embedded World 2021"},"content":{"rendered":"\n

Supplier of Computer-on-Modules (COMs) congatec<\/strong><\/a> will exhibit its range of embedded edge computing at Embedded World 2021, held digitally from March 1st\u20135th, 2021.\u00a0<\/p>\n\n\n\n

During the event, the company will highlight the technology that will facilitate digitisation projects in harsh and challenging environments, ranging from high-end edge servers to headless systems for ultra-low-power edge logic. Registration is now open on the event websit<\/a><\/strong>e<\/a>.<\/p>\n\n\n\n

congatec, which is partnered with embedded specialist Recab UK to serve the UK market, will cover the full range of embedded computing technologies for industries such as railway, smart city infrastructures, offshore rigs and electrical distribution networks.<\/p>\n\n\n\n

Highlights will include the new SMARC 2.1 COM with i.MX 8M plus processor, the new COM-HPC and COM Express modules with scalable 11th<\/sup> Gen Intel Core processors and platforms with Intel Atom\u00ae x6000E series processors.<\/p>\n\n\n\n

The SMARC 2.1 COM being showcased at the event consumes only 2-6 watts and is made of four powerful ARM Cortex-A63 processor cores and an additional Neural Processing Unit (NPU) \u2014 adding up to 2.3 Tera operations per second (TOPS) of AI computing power. The modules are also optimised for processing and analysing dual-camera Image Signal Processor (ISP) data, enabling AI interfacing and machine learning at the edge.<\/p>\n\n\n\n

Another highlight will be the exhibiting of high-end x86 COMs based on the COM-HPC and COM Express standards. The new modules \u2014 conga-HPC\/cTLU size A module and conga-TC570 COM Express compact module \u2014 are available with new, scalable 11th<\/sup> Gen Intel Core processors for extreme temperatures, and are the first to support PCIe x4 to connect peripherals with massive bandwidth. <\/p>\n\n\n\n

The new platforms for harsh environments support extreme temperature ranges from -40 to +85 degrees Celsius, feature BGA soldered processors for shock and vibration as well as high EMI resistance. They can optionally be made available with conformal coating to protect the COM against ingress from condensation, salt water and dust.<\/p>\n\n\n\n

\u201cThere is an increasing demand for reliable operation in the most challenging environments,\u201d said Martin Frederiksen, managing director of Recab UK. \u201ccongatec exhibiting at Embedded World 2021 is a great opportunity to showcase the ease of using embedded computer technologies in areas such as piping systems for the oil, gas and freshwater industries, telecommunications networks and distributed surveillance and security systems.\u201d<\/p>\n\n\n\n

Embedded World 2021 connects attendees with industry leaders in all areas of embedded technologies, from construction elements, modules and complete systems through to operating systems and software. Visitors can register their attendance to the digital exhibition now by acquiring their ticket on the Embedded World 2021 website<\/a><\/strong>, along with the agenda for the event.\u00a0<\/p>\n","protected":false},"excerpt":{"rendered":"

Supplier of Computer-on-Modules (COMs) congatec will exhibit its range of embedded edge computing at Embedded World 2021, held digitally from March 1st\u20135th, 2021.\u00a0 During the event, the company will highlight the technology that will facilitate digitisation projects in harsh and challenging environments, ranging from high-end edge servers to headless systems for ultra-low-power edge logic. Registration …<\/p>\n","protected":false},"author":1,"featured_media":19070,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[168],"tags":[8587,9219],"class_list":["post-19068","post","type-post","status-publish","format-standard","has-post-thumbnail","","category-show-time","tag-congatec","tag-embedded-world-2021"],"yoast_head":"\nEmbedded World 2021 - Engineer News Network<\/title>\n<meta name=\"description\" content=\"Embedded World 2021 will be held digitally from March 1st\u20135th, 2021\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.engineernewsnetwork.com\/blog\/embedded-world-2021\/\" \/>\n<meta property=\"og:locale\" content=\"en_GB\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Embedded World 2021 - Engineer News Network\" \/>\n<meta property=\"og:description\" content=\"Embedded World 2021 will be held digitally from March 1st\u20135th, 2021\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.engineernewsnetwork.com\/blog\/embedded-world-2021\/\" \/>\n<meta property=\"og:site_name\" content=\"Engineer News Network\" \/>\n<meta property=\"article:published_time\" content=\"2021-02-24T10:30:00+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2021\/02\/COMe-and-COMHPC-offerings-from-congatec.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"700\" \/>\n\t<meta property=\"og:image:height\" content=\"439\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"admin\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"admin\" \/>\n\t<meta name=\"twitter:label2\" content=\"Estimated reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/embedded-world-2021\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/embedded-world-2021\\\/\"},\"author\":{\"name\":\"admin\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#\\\/schema\\\/person\\\/4477342aea8e299c6a21761e513ea8e1\"},\"headline\":\"Embedded World 2021\",\"datePublished\":\"2021-02-24T10:30:00+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/embedded-world-2021\\\/\"},\"wordCount\":424,\"image\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/embedded-world-2021\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/wp-content\\\/uploads\\\/2021\\\/02\\\/COMe-and-COMHPC-offerings-from-congatec.jpg\",\"keywords\":[\"congatec\",\"Embedded World 2021\"],\"articleSection\":[\"Show Time\"],\"inLanguage\":\"en-GB\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/embedded-world-2021\\\/\",\"url\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/embedded-world-2021\\\/\",\"name\":\"Embedded World 2021 - 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