{"id":22458,"date":"2022-07-20T10:00:00","date_gmt":"2022-07-20T09:00:00","guid":{"rendered":"https:\/\/www.engineernewsnetwork.com\/blog\/?p=22458"},"modified":"2022-07-19T14:25:57","modified_gmt":"2022-07-19T13:25:57","slug":"on-wafer-device-characterisation-test-solution","status":"publish","type":"post","link":"https:\/\/www.engineernewsnetwork.com\/blog\/on-wafer-device-characterisation-test-solution\/","title":{"rendered":"On-wafer device characterisation test solution"},"content":{"rendered":"\n<p>Rohde &amp; Schwarz now offers a test solution for full RF performance characterisation of the DUT on-wafer which combines the powerful R&amp;S ZNA vector network analyser from Rohde &amp; Schwarz with engineering probe systems from FormFactor.\u00a0<\/p>\n\n\n\n<p>As a result, semiconductor manufacturers can perform reliable and repeatable on-wafer device characterisation in the development phase, during product qualification and in production.<\/p>\n\n\n\n<p>5G RF front-end designers aim to ensure proper RF capabilities for frequency coverage and output power while optimising energy efficiency. An important phase in this process is investigating the RF design, to get feedback on the design as early as possible and assess the performance and capabilities already on the wafer level. Characterizing a DUT in an on-wafer environment requires a measurement system that includes a vector network analyser (VNA), a probe station, RF probes, cables or adapters, a dedicated calibration method as well as calibration substrates for the particular DUT or application.<\/p>\n\n\n\n<p>To perform these essential measurements, Rohde &amp; Schwarz is supplying the high-end R&amp;S ZNA vector network analyser, which characterises all RF qualification parameters at coaxial and waveguide levels, as well as frequency extenders for application ranges above 67 GHz. FormFactor addresses the wafer contact with manual, semi-automated and fully automated probe systems including thermal control, high-frequency probes, probe positioners, and calibration tools. The calibration of the complete test system, including the R&amp;S ZNA, is fully supported in the FormFactor WinCal XE calibration software.<\/p>\n\n\n\n<p>In the test set-up, the user has access to all test capabilities of the R&amp;S ZNA thanks to the fully calibrated set-up. Generic S-parameter tests allow characterisation for filters and active devices, but distortion, gain and intermodulation tests can also be performed to qualify power amplifiers.&nbsp;<\/p>\n\n\n\n<p>Frequency translating measurements for mixers with phase characterisation across the bandwidth of the device are another example of the supported measurement applications of the joint solution. The fully calibrated setups also allow all results to be directly taken from the VNA without post-processing as the calibration data are applied<\/p>\n\n\n\n<p>directly to the VNA. Frequency extenders from Rohde &amp; Schwarz open up sub-THz frequencies such as Dband, currently in the focus of 6G research. The extenders will be integrated to the probe station to ensure shortest cabling and enable optimal dynamic range while avoiding losses due to cabling to the probe tip.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Rohde &amp; Schwarz now offers a test solution for full RF performance characterisation of the DUT on-wafer which combines the powerful R&amp;S ZNA vector network analyser from Rohde &amp; Schwarz with engineering probe systems from FormFactor.\u00a0 As a result, semiconductor manufacturers can perform reliable and repeatable on-wafer device characterisation in the development phase, during product &hellip;<\/p>\n","protected":false},"author":1,"featured_media":22459,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[104],"tags":[],"class_list":["post-22458","post","type-post","status-publish","format-standard","has-post-thumbnail","","category-electronics"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>On-wafer device characterisation test solution - Engineer News Network<\/title>\n<meta name=\"description\" content=\"Rohde &amp; Schwarz now offers a test solution for full RF performance characterisation of the DUT on-wafer which combines the powerful R&amp;S ZNA vector network analyser from Rohde &amp; Schwarz with engineering probe systems from FormFactor\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.engineernewsnetwork.com\/blog\/on-wafer-device-characterisation-test-solution\/\" \/>\n<meta property=\"og:locale\" content=\"en_GB\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"On-wafer device characterisation test solution - Engineer News Network\" \/>\n<meta property=\"og:description\" content=\"Rohde &amp; Schwarz now offers a test solution for full RF performance characterisation of the DUT on-wafer which combines the powerful R&amp;S ZNA vector network analyser from Rohde &amp; Schwarz with engineering probe systems from FormFactor\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.engineernewsnetwork.com\/blog\/on-wafer-device-characterisation-test-solution\/\" \/>\n<meta property=\"og:site_name\" content=\"Engineer News Network\" \/>\n<meta property=\"article:published_time\" content=\"2022-07-20T09:00:00+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2022\/07\/MG_5369a_ret.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1920\" \/>\n\t<meta property=\"og:image:height\" content=\"1280\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"admin\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"admin\" \/>\n\t<meta name=\"twitter:label2\" content=\"Estimated reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/on-wafer-device-characterisation-test-solution\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/on-wafer-device-characterisation-test-solution\\\/\"},\"author\":{\"name\":\"admin\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#\\\/schema\\\/person\\\/4477342aea8e299c6a21761e513ea8e1\"},\"headline\":\"On-wafer device characterisation test solution\",\"datePublished\":\"2022-07-20T09:00:00+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/on-wafer-device-characterisation-test-solution\\\/\"},\"wordCount\":395,\"image\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/on-wafer-device-characterisation-test-solution\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/wp-content\\\/uploads\\\/2022\\\/07\\\/MG_5369a_ret.jpg\",\"articleSection\":[\"Electronics\"],\"inLanguage\":\"en-GB\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/on-wafer-device-characterisation-test-solution\\\/\",\"url\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/on-wafer-device-characterisation-test-solution\\\/\",\"name\":\"On-wafer device characterisation test solution - Engineer News Network\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/on-wafer-device-characterisation-test-solution\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/on-wafer-device-characterisation-test-solution\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/wp-content\\\/uploads\\\/2022\\\/07\\\/MG_5369a_ret.jpg\",\"datePublished\":\"2022-07-20T09:00:00+00:00\",\"author\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#\\\/schema\\\/person\\\/4477342aea8e299c6a21761e513ea8e1\"},\"description\":\"Rohde & Schwarz now offers a test solution for full RF performance characterisation of the DUT on-wafer which combines the powerful R&S ZNA vector network analyser from Rohde & Schwarz with engineering probe systems from FormFactor\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/on-wafer-device-characterisation-test-solution\\\/#breadcrumb\"},\"inLanguage\":\"en-GB\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/on-wafer-device-characterisation-test-solution\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-GB\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/on-wafer-device-characterisation-test-solution\\\/#primaryimage\",\"url\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/wp-content\\\/uploads\\\/2022\\\/07\\\/MG_5369a_ret.jpg\",\"contentUrl\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/wp-content\\\/uploads\\\/2022\\\/07\\\/MG_5369a_ret.jpg\",\"width\":1920,\"height\":1280,\"caption\":\"R&S ZNA performing on-wafer measurements together with FormFactor SUMMIT200 probe system. Image: FormFactor\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/on-wafer-device-characterisation-test-solution\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"On-wafer device characterisation test solution\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#website\",\"url\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/\",\"name\":\"Engineer News Network\",\"description\":\"The ultimate online news and information resource for today's engineer\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-GB\"},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#\\\/schema\\\/person\\\/4477342aea8e299c6a21761e513ea8e1\",\"name\":\"admin\",\"url\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/author\\\/admin\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"On-wafer device characterisation test solution - Engineer News Network","description":"Rohde & Schwarz now offers a test solution for full RF performance characterisation of the DUT on-wafer which combines the powerful R&S ZNA vector network analyser from Rohde & Schwarz with engineering probe systems from FormFactor","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.engineernewsnetwork.com\/blog\/on-wafer-device-characterisation-test-solution\/","og_locale":"en_GB","og_type":"article","og_title":"On-wafer device characterisation test solution - Engineer News Network","og_description":"Rohde & Schwarz now offers a test solution for full RF performance characterisation of the DUT on-wafer which combines the powerful R&S ZNA vector network analyser from Rohde & Schwarz with engineering probe systems from FormFactor","og_url":"https:\/\/www.engineernewsnetwork.com\/blog\/on-wafer-device-characterisation-test-solution\/","og_site_name":"Engineer News Network","article_published_time":"2022-07-20T09:00:00+00:00","og_image":[{"width":1920,"height":1280,"url":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2022\/07\/MG_5369a_ret.jpg","type":"image\/jpeg"}],"author":"admin","twitter_card":"summary_large_image","twitter_misc":{"Written by":"admin","Estimated reading time":"2 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/on-wafer-device-characterisation-test-solution\/#article","isPartOf":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/on-wafer-device-characterisation-test-solution\/"},"author":{"name":"admin","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#\/schema\/person\/4477342aea8e299c6a21761e513ea8e1"},"headline":"On-wafer device characterisation test solution","datePublished":"2022-07-20T09:00:00+00:00","mainEntityOfPage":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/on-wafer-device-characterisation-test-solution\/"},"wordCount":395,"image":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/on-wafer-device-characterisation-test-solution\/#primaryimage"},"thumbnailUrl":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2022\/07\/MG_5369a_ret.jpg","articleSection":["Electronics"],"inLanguage":"en-GB"},{"@type":"WebPage","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/on-wafer-device-characterisation-test-solution\/","url":"https:\/\/www.engineernewsnetwork.com\/blog\/on-wafer-device-characterisation-test-solution\/","name":"On-wafer device characterisation test solution - Engineer News Network","isPartOf":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/on-wafer-device-characterisation-test-solution\/#primaryimage"},"image":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/on-wafer-device-characterisation-test-solution\/#primaryimage"},"thumbnailUrl":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2022\/07\/MG_5369a_ret.jpg","datePublished":"2022-07-20T09:00:00+00:00","author":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#\/schema\/person\/4477342aea8e299c6a21761e513ea8e1"},"description":"Rohde & Schwarz now offers a test solution for full RF performance characterisation of the DUT on-wafer which combines the powerful R&S ZNA vector network analyser from Rohde & Schwarz with engineering probe systems from FormFactor","breadcrumb":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/on-wafer-device-characterisation-test-solution\/#breadcrumb"},"inLanguage":"en-GB","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.engineernewsnetwork.com\/blog\/on-wafer-device-characterisation-test-solution\/"]}]},{"@type":"ImageObject","inLanguage":"en-GB","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/on-wafer-device-characterisation-test-solution\/#primaryimage","url":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2022\/07\/MG_5369a_ret.jpg","contentUrl":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2022\/07\/MG_5369a_ret.jpg","width":1920,"height":1280,"caption":"R&S ZNA performing on-wafer measurements together with FormFactor SUMMIT200 probe system. Image: FormFactor"},{"@type":"BreadcrumbList","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/on-wafer-device-characterisation-test-solution\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.engineernewsnetwork.com\/blog\/"},{"@type":"ListItem","position":2,"name":"On-wafer device characterisation test solution"}]},{"@type":"WebSite","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#website","url":"https:\/\/www.engineernewsnetwork.com\/blog\/","name":"Engineer News Network","description":"The ultimate online news and information resource for today's engineer","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.engineernewsnetwork.com\/blog\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-GB"},{"@type":"Person","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#\/schema\/person\/4477342aea8e299c6a21761e513ea8e1","name":"admin","url":"https:\/\/www.engineernewsnetwork.com\/blog\/author\/admin\/"}]}},"_links":{"self":[{"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/posts\/22458","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/comments?post=22458"}],"version-history":[{"count":1,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/posts\/22458\/revisions"}],"predecessor-version":[{"id":22460,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/posts\/22458\/revisions\/22460"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/media\/22459"}],"wp:attachment":[{"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/media?parent=22458"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/categories?post=22458"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/tags?post=22458"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}