{"id":2954,"date":"2017-11-30T07:17:47","date_gmt":"2017-11-30T07:17:47","guid":{"rendered":"https:\/\/engineernewsnetwork.com\/blog\/?p=2954"},"modified":"2017-11-29T11:18:19","modified_gmt":"2017-11-29T11:18:19","slug":"toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory","status":"publish","type":"post","link":"https:\/\/www.engineernewsnetwork.com\/blog\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\/","title":{"rendered":"Toshiba unveils UFS devices utilising 64-Layer, 3D Flash Memory"},"content":{"rendered":"<span class=\"highlight highlight-blue\"><a href=\"http:\/\/toshiba.semicon-storage.com\" target=\"_blank\" rel=\"noopener\">Toshiba Memory Europe GmbH<\/a><\/span> has started sampling Universal Flash Storage (UFS) devices\u00a0utilising <span class=\"highlight highlight-blue\"><a href=\"https:\/\/engineernewsnetwork.com\/blog\/2889-2\/\" target=\"_blank\" rel=\"noopener\">Toshiba<\/a><\/span> Memory Corporation\u2019s cutting-edge 64-layer, BiCS FLASH 3D flash memory.<\/p>\n<p>The new UFS devices meet performance demands for applications that require high-speed read\/write performance and low power consumption, including mobile devices such as smartphones and tablets, and augmented and virtual reality systems.<br \/>\n<script async src=\"\/\/pagead2.googlesyndication.com\/pagead\/js\/adsbygoogle.js\"><\/script><br \/>\n<ins class=\"adsbygoogle\" style=\"display: block; text-align: center;\" data-ad-format=\"fluid\" data-ad-layout=\"in-article\" data-ad-client=\"ca-pub-7565662001938327\" data-ad-slot=\"7585079586\"><\/ins><br \/>\n<script>\n(adsbygoogle = window.adsbygoogle || []).push({});\n<\/script><br \/>\nThe new line-up will be available in four capacities: 32GB, 64GB, 128GB and 256GB.<\/p>\n<p>All of the devices integrate flash memory and a controller in a single, JEDEC-standard 11.5 x 13mm package.<\/p>\n<p>The controller performs error correction, wear levelling, logical-to-physical address translation and bad-block management, allowing users to simplify system development.<\/p>\n<p>All four devices are compliant with JEDEC UFS Ver2.1, including HS-GEAR3, which has a theoretical interface speed of up to 5.8Gbps per lane (x2 lanes = 11.6Gbps) while also suppressing any increase in power consumption.<\/p>\n<p>Sequential read and write performance\u00a0of the 64GB device are 900MB\/s and 180MB\/s, while the random read and write performance are around 200% and 185% better, respectively, than those of previous generation devices.<\/p>\n<p>Due to its serial interface, UFS supports full duplexing, which enables both concurrent reading and writing between the host processor and UFS device.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Toshiba Memory Europe GmbH has started sampling Universal Flash Storage (UFS) devices\u00a0utilising Toshiba Memory Corporation\u2019s cutting-edge 64-layer, BiCS FLASH 3D flash memory. The new UFS devices meet performance demands for applications that require high-speed read\/write performance and low power consumption, including mobile devices such as smartphones and tablets, and augmented and virtual reality systems. The &hellip;<\/p>\n","protected":false},"author":1,"featured_media":2955,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[104],"tags":[1360,1359,1356,1357,1358],"class_list":["post-2954","post","type-post","status-publish","format-standard","has-post-thumbnail","","category-electronics","tag-augmented-and-virtual-reality-systems","tag-smartphones-and-tablets","tag-toshiba-memory-europe","tag-ufs","tag-universal-flash-storage"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Toshiba unveils UFS devices utilising 64-Layer, 3D Flash Memory - Engineer News Network<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.engineernewsnetwork.com\/blog\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\/\" \/>\n<meta property=\"og:locale\" content=\"en_GB\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Toshiba unveils UFS devices utilising 64-Layer, 3D Flash Memory - Engineer News Network\" \/>\n<meta property=\"og:description\" content=\"Toshiba Memory Europe GmbH has started sampling Universal Flash Storage (UFS) devices\u00a0utilising Toshiba Memory Corporation\u2019s cutting-edge 64-layer, BiCS FLASH 3D flash memory. The new UFS devices meet performance demands for applications that require high-speed read\/write performance and low power consumption, including mobile devices such as smartphones and tablets, and augmented and virtual reality systems. The &hellip;\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.engineernewsnetwork.com\/blog\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\/\" \/>\n<meta property=\"og:site_name\" content=\"Engineer News Network\" \/>\n<meta property=\"article:published_time\" content=\"2017-11-30T07:17:47+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2017\/11\/TME001A_UFS_BiCS_64GB_LRES.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1366\" \/>\n\t<meta property=\"og:image:height\" content=\"976\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"admin\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"admin\" \/>\n\t<meta name=\"twitter:label2\" content=\"Estimated reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\\\/\"},\"author\":{\"name\":\"admin\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#\\\/schema\\\/person\\\/4477342aea8e299c6a21761e513ea8e1\"},\"headline\":\"Toshiba unveils UFS devices utilising 64-Layer, 3D Flash Memory\",\"datePublished\":\"2017-11-30T07:17:47+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\\\/\"},\"wordCount\":214,\"commentCount\":0,\"image\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/wp-content\\\/uploads\\\/2017\\\/11\\\/TME001A_UFS_BiCS_64GB_LRES.jpg\",\"keywords\":[\"augmented and virtual reality systems\",\"smartphones and tablets\",\"Toshiba Memory Europe\",\"UFS\",\"Universal Flash Storage\"],\"articleSection\":[\"Electronics\"],\"inLanguage\":\"en-GB\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\\\/#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\\\/\",\"url\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\\\/\",\"name\":\"Toshiba unveils UFS devices utilising 64-Layer, 3D Flash Memory - Engineer News Network\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/wp-content\\\/uploads\\\/2017\\\/11\\\/TME001A_UFS_BiCS_64GB_LRES.jpg\",\"datePublished\":\"2017-11-30T07:17:47+00:00\",\"author\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#\\\/schema\\\/person\\\/4477342aea8e299c6a21761e513ea8e1\"},\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\\\/#breadcrumb\"},\"inLanguage\":\"en-GB\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-GB\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\\\/#primaryimage\",\"url\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/wp-content\\\/uploads\\\/2017\\\/11\\\/TME001A_UFS_BiCS_64GB_LRES.jpg\",\"contentUrl\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/wp-content\\\/uploads\\\/2017\\\/11\\\/TME001A_UFS_BiCS_64GB_LRES.jpg\",\"width\":1366,\"height\":976},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Toshiba unveils UFS devices utilising 64-Layer, 3D Flash Memory\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#website\",\"url\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/\",\"name\":\"Engineer News Network\",\"description\":\"The ultimate online news and information resource for today's engineer\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-GB\"},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#\\\/schema\\\/person\\\/4477342aea8e299c6a21761e513ea8e1\",\"name\":\"admin\",\"url\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/author\\\/admin\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Toshiba unveils UFS devices utilising 64-Layer, 3D Flash Memory - Engineer News Network","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.engineernewsnetwork.com\/blog\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\/","og_locale":"en_GB","og_type":"article","og_title":"Toshiba unveils UFS devices utilising 64-Layer, 3D Flash Memory - Engineer News Network","og_description":"Toshiba Memory Europe GmbH has started sampling Universal Flash Storage (UFS) devices\u00a0utilising Toshiba Memory Corporation\u2019s cutting-edge 64-layer, BiCS FLASH 3D flash memory. The new UFS devices meet performance demands for applications that require high-speed read\/write performance and low power consumption, including mobile devices such as smartphones and tablets, and augmented and virtual reality systems. The &hellip;","og_url":"https:\/\/www.engineernewsnetwork.com\/blog\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\/","og_site_name":"Engineer News Network","article_published_time":"2017-11-30T07:17:47+00:00","og_image":[{"width":1366,"height":976,"url":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2017\/11\/TME001A_UFS_BiCS_64GB_LRES.jpg","type":"image\/jpeg"}],"author":"admin","twitter_card":"summary_large_image","twitter_misc":{"Written by":"admin","Estimated reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\/#article","isPartOf":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\/"},"author":{"name":"admin","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#\/schema\/person\/4477342aea8e299c6a21761e513ea8e1"},"headline":"Toshiba unveils UFS devices utilising 64-Layer, 3D Flash Memory","datePublished":"2017-11-30T07:17:47+00:00","mainEntityOfPage":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\/"},"wordCount":214,"commentCount":0,"image":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\/#primaryimage"},"thumbnailUrl":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2017\/11\/TME001A_UFS_BiCS_64GB_LRES.jpg","keywords":["augmented and virtual reality systems","smartphones and tablets","Toshiba Memory Europe","UFS","Universal Flash Storage"],"articleSection":["Electronics"],"inLanguage":"en-GB","potentialAction":[{"@type":"CommentAction","name":"Comment","target":["https:\/\/www.engineernewsnetwork.com\/blog\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\/#respond"]}]},{"@type":"WebPage","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\/","url":"https:\/\/www.engineernewsnetwork.com\/blog\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\/","name":"Toshiba unveils UFS devices utilising 64-Layer, 3D Flash Memory - Engineer News Network","isPartOf":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\/#primaryimage"},"image":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\/#primaryimage"},"thumbnailUrl":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2017\/11\/TME001A_UFS_BiCS_64GB_LRES.jpg","datePublished":"2017-11-30T07:17:47+00:00","author":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#\/schema\/person\/4477342aea8e299c6a21761e513ea8e1"},"breadcrumb":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\/#breadcrumb"},"inLanguage":"en-GB","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.engineernewsnetwork.com\/blog\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\/"]}]},{"@type":"ImageObject","inLanguage":"en-GB","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\/#primaryimage","url":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2017\/11\/TME001A_UFS_BiCS_64GB_LRES.jpg","contentUrl":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2017\/11\/TME001A_UFS_BiCS_64GB_LRES.jpg","width":1366,"height":976},{"@type":"BreadcrumbList","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/toshiba-unveils-ufs-devices-utilising-64-layer-3d-flash-memory\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.engineernewsnetwork.com\/blog\/"},{"@type":"ListItem","position":2,"name":"Toshiba unveils UFS devices utilising 64-Layer, 3D Flash Memory"}]},{"@type":"WebSite","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#website","url":"https:\/\/www.engineernewsnetwork.com\/blog\/","name":"Engineer News Network","description":"The ultimate online news and information resource for today's engineer","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.engineernewsnetwork.com\/blog\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-GB"},{"@type":"Person","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#\/schema\/person\/4477342aea8e299c6a21761e513ea8e1","name":"admin","url":"https:\/\/www.engineernewsnetwork.com\/blog\/author\/admin\/"}]}},"_links":{"self":[{"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/posts\/2954","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/comments?post=2954"}],"version-history":[{"count":2,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/posts\/2954\/revisions"}],"predecessor-version":[{"id":2957,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/posts\/2954\/revisions\/2957"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/media\/2955"}],"wp:attachment":[{"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/media?parent=2954"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/categories?post=2954"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/tags?post=2954"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}