{"id":31691,"date":"2026-03-31T09:15:00","date_gmt":"2026-03-31T08:15:00","guid":{"rendered":"https:\/\/www.engineernewsnetwork.com\/blog\/?p=31691"},"modified":"2026-03-24T14:42:30","modified_gmt":"2026-03-24T14:42:30","slug":"automotive-qualified-system-in-package-hybrid-mcu-for-automotive-and-e-mobility-hmi-applications","status":"publish","type":"post","link":"https:\/\/www.engineernewsnetwork.com\/blog\/automotive-qualified-system-in-package-hybrid-mcu-for-automotive-and-e-mobility-hmi-applications\/","title":{"rendered":"Automotive-qualified system-in-package hybrid MCU for automotive and e-mobility HMI applications"},"content":{"rendered":"\n

Automotive and E-Mobility designers are incorporating more Human-Machine Interfaces (HMIs) with sophisticated graphics to enhance the user experience. To address the growing demand for HMI solutions, Microchip Technology announces the AEC-Q100 Grade 2-qualified, SAM9X75D5M System-in-Package (SiP)<\/strong><\/a> with an Arm926EJ-S processor and 512 Mbit DDR2 SDRAM. The SAM9X75D5M supports large display sizes up to 10 inches and XGA resolution of 1024 \u00d7 768 pixels.<\/p>\n\n\n\n

The SAM9X75D5M is part of Microchip\u2019s hybrid MCU family that enables users to capitalize on the advanced processing capabilities of a microprocessor (MPU) with access to embedded, higher memory densities while maintaining the familiar development environment of MCU-based designs, and the option to develop using Real-Time Operating Systems (RTOS). Tailored for automotive applications such as digital cockpit clusters, smart clusters for two- and three-wheelers, HVAC control, EV chargers and more, the SAM9X75D5M hybrid MCU SiP streamlines the development process by combining the MPU and memory into a single package. The device provides ample buffer space for automotive displays and offers flexible display interface options, including MIPI Display Serial Interface (DSI), Low Voltage Differential Signaling (LVDS) and RGB data in parallel.<\/p>\n\n\n\n

With a simplified PCB layout, the SAM9X75D5M can reduce routing complexity and minimize discrete DRAM procurement risk and is built to support long-term availability and reliability. As a hybrid MCU, its architecture is designed to balance cost, performance and power efficiency, offering a migration path for applications transitioning from traditional microcontrollers (MCUs) to MPUs to meet higher performance and memory demands. <\/p>\n\n\n\n

By integrating DDR2 memory directly into the package, the SAM9X75D5M helps protect designers from the volatility and supply constraints that have historically affected the discrete DDR memory market. This single-chip solution offers more predictable supply availability than discrete DDR memory and helps eliminate the procurement challenges associated with sourcing separate memory components.<\/p>\n\n\n\n

\u201cMicrochip\u2019s SAM9X75D5M product redefines the standard for automotive-grade solutions, combining a high-performance processor with memory in a single package and bringing benefits of a SiP to the automotive market,\u201d said Rod Drake, corporate vice president of Microchip Technology\u2019s MPU business unit. \u201cOne of the advantages of a SiP is that it provides significantly more RAM buffer space than a traditional MCU implementation and on a much more compact PCB than can be done with discrete memory \u2014 giving designers options to fit complex designs into a small space.\u201d<\/p>\n\n\n\n

The SAM9X75D5M features a comprehensive range of advanced connectivity options, including CAN FD, USB and Gigabit Ethernet (GbE). It also supports the Time-Sensitive Networking (TSN) protocol and comes with integrated 2D graphics and audio capabilities.<\/p>\n\n\n\n

In addition to these devices, Microchip offers a full array of devices to support HMI systems including maXTouch technology, which provides reliable touch sensing, even in harsh environments or with water on the LCD screen, as well as power management and connectivity solutions.<\/p>\n","protected":false},"excerpt":{"rendered":"

Automotive and E-Mobility designers are incorporating more Human-Machine Interfaces (HMIs) with sophisticated graphics to enhance the user experience. To address the growing demand for HMI solutions, Microchip Technology announces the AEC-Q100 Grade 2-qualified, SAM9X75D5M System-in-Package (SiP) with an Arm926EJ-S processor and 512 Mbit DDR2 SDRAM. The SAM9X75D5M supports large display sizes up to 10 inches …<\/p>\n","protected":false},"author":1,"featured_media":31692,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[104],"tags":[2732,14634],"class_list":["post-31691","post","type-post","status-publish","format-standard","has-post-thumbnail","","category-electronics","tag-microchip-technology","tag-sam9x75d5m-system-in-package-sip"],"yoast_head":"\nAutomotive-qualified system-in-package hybrid MCU for automotive and e-mobility HMI applications - Engineer News Network<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.engineernewsnetwork.com\/blog\/automotive-qualified-system-in-package-hybrid-mcu-for-automotive-and-e-mobility-hmi-applications\/\" \/>\n<meta property=\"og:locale\" content=\"en_GB\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Automotive-qualified system-in-package hybrid MCU for automotive and e-mobility HMI applications - Engineer News Network\" \/>\n<meta property=\"og:description\" content=\"Automotive and E-Mobility designers are incorporating more Human-Machine Interfaces (HMIs) with sophisticated graphics to enhance the user experience. 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