{"id":3526,"date":"2017-12-20T10:43:06","date_gmt":"2017-12-20T10:43:06","guid":{"rendered":"https:\/\/engineernewsnetwork.com\/blog\/?p=3526"},"modified":"2017-12-21T09:17:34","modified_gmt":"2017-12-21T09:17:34","slug":"3526-2","status":"publish","type":"post","link":"https:\/\/www.engineernewsnetwork.com\/blog\/3526-2\/","title":{"rendered":"CES 2018: ON Semiconductor technologies for automotive and IoT applications"},"content":{"rendered":"<span class=\"highlight highlight-blue\"><a href=\"http:\/\/www.onsemi.com\" target=\"_blank\" rel=\"noopener\">ON Semiconductor<\/a><\/span> will be focusing on its technologies that are enabling the progression towards fully autonomous driving and increased electronic content in connected vehicles at the 2018 Consumer Electronics Show (CES) in Las Vegas, 9th-12th January, 2018.<\/p>\n<p>Among multiple exhibits will be interactive demonstrations that will allow visitors to experience and understand the company\u2019s industry leading solutions in these exciting and fast moving areas of technology.<br \/>\n<script async src=\"\/\/pagead2.googlesyndication.com\/pagead\/js\/adsbygoogle.js\"><\/script><br \/>\n<ins class=\"adsbygoogle\"\n     style=\"display:block; text-align:center;\"\n     data-ad-layout=\"in-article\"\n     data-ad-format=\"fluid\"\n     data-ad-client=\"ca-pub-7565662001938327\"\n     data-ad-slot=\"7585079586\"><\/ins><br \/>\n<script>\n     (adsbygoogle = window.adsbygoogle || []).push({});\n<\/script><br \/>\nThe Automotive Image Sensing Applications Platform demonstration will enable attendees to see the real-world performance of the company\u2019s latest image sensors in various\u00a0Advanced Driver Assistance Systems (ADAS) applications including front view, surround view, rear view and driver monitoring.<\/p>\n<p>Image sensors from <span class=\"highlight highlight-blue\"><a href=\"https:\/\/engineernewsnetwork.com\/blog\/clean-accurate-images-in-bright-and-low-light-conditions\/\">ON Semiconductor<\/a><\/span> achieve current and future industry performance level requirements in terms of resolution, clarity, mixed and poor light conditions and robustness for level three driving autonomy and beyond.<\/p>\n<p>As the extent and diversity of vehicle electronic content continues its rapid upward trend in areas such as safety, infotainment, comfort and convenience, ON Semiconductor\u2019s broad range of technologies and system solutions continue to be fundamental to their development and implementation.<\/p>\n<p>At CES, the company\u2019s Intelligent Automotive Solutions demonstration vehicle will showcase the advanced connectivity features of ON Semiconductor automotive products that bring multiple benefits including wire replacement with associated weight, space and complexity savings, increased safety and a better overall driver experience.<\/p>\n<p>The demonstration will include technologies in the fields of wireless actuation and communications, battery-free sensing, electronic fuses, USB Type-C and power delivery and Bluetooth low energy technology for several in-car applications using a new variant of the hugely successful RSL10 radio System-on-Chip (SoC)designed and qualified specifically for automotive.<\/p>\n<p>A highly interactive Automotive Virtual Reality demonstration will allow visitors to look under the hood and sit inside a 3D model of a next generation vehicle.<\/p>\n<p>Outfitted with cutting edge automotive solutions, this demo will allow users to experience <span class=\"highlight highlight-blue\"><a href=\"https:\/\/engineernewsnetwork.com\/blog\/image-sensor-ensures-detail-captured-in-both-bright-and-poor-light-areas-in-the-same-scene\/\" target=\"_blank\" rel=\"noopener\">ON Semiconductor<\/a><\/span> solutions for semi-autonomous\/autonomous driving scenarios including collision avoidance, drowsy driving, and level 5 fully autonomous driving.<\/p>\n<p>In addition to automotive applications, ON Semiconductor will illustrate its expertise and innovations in areas such as smart passive sensing, image sensing, USB Type-C and integrated power management solutions that are enabling the development of compelling new end products across multiple sectors.<\/p>\n<p>Many of these can be seen on display around CES, including IoT applications relating to smart home\/smart buildings, security and surveillance, and augmented and virtual reality (AR\/VR) for both consumer and industrial applications.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>ON Semiconductor will be focusing on its technologies that are enabling the progression towards fully autonomous driving and increased electronic content in connected vehicles at the 2018 Consumer Electronics Show (CES) in Las Vegas, 9th-12th January, 2018. Among multiple exhibits will be interactive demonstrations that will allow visitors to experience and understand the company\u2019s industry &hellip;<\/p>\n","protected":false},"author":1,"featured_media":3527,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[104],"tags":[121,1700,1550,193,263,1703,1704,1702,1701],"class_list":["post-3526","post","type-post","status-publish","format-standard","has-post-thumbnail","","category-electronics","tag-automotive","tag-ces-2018","tag-connectivity","tag-iot","tag-on-semiconductor","tag-power-management","tag-semiconductor","tag-sensing","tag-vision"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>CES 2018: ON Semiconductor technologies for automotive and IoT applications - Engineer News Network<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.engineernewsnetwork.com\/blog\/3526-2\/\" \/>\n<meta property=\"og:locale\" content=\"en_GB\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"CES 2018: ON Semiconductor technologies for automotive and IoT applications - Engineer News Network\" \/>\n<meta property=\"og:description\" content=\"ON Semiconductor will be focusing on its technologies that are enabling the progression towards fully autonomous driving and increased electronic content in connected vehicles at the 2018 Consumer Electronics Show (CES) in Las Vegas, 9th-12th January, 2018. Among multiple exhibits will be interactive demonstrations that will allow visitors to experience and understand the company\u2019s industry &hellip;\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.engineernewsnetwork.com\/blog\/3526-2\/\" \/>\n<meta property=\"og:site_name\" content=\"Engineer News Network\" \/>\n<meta property=\"article:published_time\" content=\"2017-12-20T10:43:06+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2017-12-21T09:17:34+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2017\/12\/ONSPR2945_RSL10_HRES.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1000\" \/>\n\t<meta property=\"og:image:height\" content=\"1000\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"admin\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"admin\" \/>\n\t<meta name=\"twitter:label2\" content=\"Estimated reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/3526-2\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/3526-2\\\/\"},\"author\":{\"name\":\"admin\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#\\\/schema\\\/person\\\/4477342aea8e299c6a21761e513ea8e1\"},\"headline\":\"CES 2018: ON Semiconductor technologies for automotive and IoT applications\",\"datePublished\":\"2017-12-20T10:43:06+00:00\",\"dateModified\":\"2017-12-21T09:17:34+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/3526-2\\\/\"},\"wordCount\":427,\"image\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/3526-2\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/wp-content\\\/uploads\\\/2017\\\/12\\\/ONSPR2945_RSL10_HRES.jpg\",\"keywords\":[\"automotive\",\"CES 2018\",\"connectivity\",\"IoT\",\"ON Semiconductor\",\"power management\",\"semiconductor\",\"sensing\",\"Vision\"],\"articleSection\":[\"Electronics\"],\"inLanguage\":\"en-GB\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/3526-2\\\/\",\"url\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/3526-2\\\/\",\"name\":\"CES 2018: ON Semiconductor technologies for automotive and IoT applications - Engineer News Network\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/3526-2\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/3526-2\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/wp-content\\\/uploads\\\/2017\\\/12\\\/ONSPR2945_RSL10_HRES.jpg\",\"datePublished\":\"2017-12-20T10:43:06+00:00\",\"dateModified\":\"2017-12-21T09:17:34+00:00\",\"author\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#\\\/schema\\\/person\\\/4477342aea8e299c6a21761e513ea8e1\"},\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/3526-2\\\/#breadcrumb\"},\"inLanguage\":\"en-GB\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/3526-2\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-GB\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/3526-2\\\/#primaryimage\",\"url\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/wp-content\\\/uploads\\\/2017\\\/12\\\/ONSPR2945_RSL10_HRES.jpg\",\"contentUrl\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/wp-content\\\/uploads\\\/2017\\\/12\\\/ONSPR2945_RSL10_HRES.jpg\",\"width\":1000,\"height\":1000},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/3526-2\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"CES 2018: ON Semiconductor technologies for automotive and IoT applications\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#website\",\"url\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/\",\"name\":\"Engineer News Network\",\"description\":\"The ultimate online news and information resource for today's engineer\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-GB\"},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/#\\\/schema\\\/person\\\/4477342aea8e299c6a21761e513ea8e1\",\"name\":\"admin\",\"url\":\"https:\\\/\\\/www.engineernewsnetwork.com\\\/blog\\\/author\\\/admin\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"CES 2018: ON Semiconductor technologies for automotive and IoT applications - Engineer News Network","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.engineernewsnetwork.com\/blog\/3526-2\/","og_locale":"en_GB","og_type":"article","og_title":"CES 2018: ON Semiconductor technologies for automotive and IoT applications - Engineer News Network","og_description":"ON Semiconductor will be focusing on its technologies that are enabling the progression towards fully autonomous driving and increased electronic content in connected vehicles at the 2018 Consumer Electronics Show (CES) in Las Vegas, 9th-12th January, 2018. Among multiple exhibits will be interactive demonstrations that will allow visitors to experience and understand the company\u2019s industry &hellip;","og_url":"https:\/\/www.engineernewsnetwork.com\/blog\/3526-2\/","og_site_name":"Engineer News Network","article_published_time":"2017-12-20T10:43:06+00:00","article_modified_time":"2017-12-21T09:17:34+00:00","og_image":[{"width":1000,"height":1000,"url":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2017\/12\/ONSPR2945_RSL10_HRES.jpg","type":"image\/jpeg"}],"author":"admin","twitter_card":"summary_large_image","twitter_misc":{"Written by":"admin","Estimated reading time":"2 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/3526-2\/#article","isPartOf":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/3526-2\/"},"author":{"name":"admin","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#\/schema\/person\/4477342aea8e299c6a21761e513ea8e1"},"headline":"CES 2018: ON Semiconductor technologies for automotive and IoT applications","datePublished":"2017-12-20T10:43:06+00:00","dateModified":"2017-12-21T09:17:34+00:00","mainEntityOfPage":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/3526-2\/"},"wordCount":427,"image":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/3526-2\/#primaryimage"},"thumbnailUrl":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2017\/12\/ONSPR2945_RSL10_HRES.jpg","keywords":["automotive","CES 2018","connectivity","IoT","ON Semiconductor","power management","semiconductor","sensing","Vision"],"articleSection":["Electronics"],"inLanguage":"en-GB"},{"@type":"WebPage","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/3526-2\/","url":"https:\/\/www.engineernewsnetwork.com\/blog\/3526-2\/","name":"CES 2018: ON Semiconductor technologies for automotive and IoT applications - Engineer News Network","isPartOf":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/3526-2\/#primaryimage"},"image":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/3526-2\/#primaryimage"},"thumbnailUrl":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2017\/12\/ONSPR2945_RSL10_HRES.jpg","datePublished":"2017-12-20T10:43:06+00:00","dateModified":"2017-12-21T09:17:34+00:00","author":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#\/schema\/person\/4477342aea8e299c6a21761e513ea8e1"},"breadcrumb":{"@id":"https:\/\/www.engineernewsnetwork.com\/blog\/3526-2\/#breadcrumb"},"inLanguage":"en-GB","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.engineernewsnetwork.com\/blog\/3526-2\/"]}]},{"@type":"ImageObject","inLanguage":"en-GB","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/3526-2\/#primaryimage","url":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2017\/12\/ONSPR2945_RSL10_HRES.jpg","contentUrl":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2017\/12\/ONSPR2945_RSL10_HRES.jpg","width":1000,"height":1000},{"@type":"BreadcrumbList","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/3526-2\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.engineernewsnetwork.com\/blog\/"},{"@type":"ListItem","position":2,"name":"CES 2018: ON Semiconductor technologies for automotive and IoT applications"}]},{"@type":"WebSite","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#website","url":"https:\/\/www.engineernewsnetwork.com\/blog\/","name":"Engineer News Network","description":"The ultimate online news and information resource for today's engineer","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.engineernewsnetwork.com\/blog\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-GB"},{"@type":"Person","@id":"https:\/\/www.engineernewsnetwork.com\/blog\/#\/schema\/person\/4477342aea8e299c6a21761e513ea8e1","name":"admin","url":"https:\/\/www.engineernewsnetwork.com\/blog\/author\/admin\/"}]}},"_links":{"self":[{"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/posts\/3526","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/comments?post=3526"}],"version-history":[{"count":11,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/posts\/3526\/revisions"}],"predecessor-version":[{"id":3540,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/posts\/3526\/revisions\/3540"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/media\/3527"}],"wp:attachment":[{"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/media?parent=3526"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/categories?post=3526"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.engineernewsnetwork.com\/blog\/wp-json\/wp\/v2\/tags?post=3526"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}