{"id":6857,"date":"2018-04-27T08:00:32","date_gmt":"2018-04-27T07:00:32","guid":{"rendered":"https:\/\/engineernewsnetwork.com\/blog\/?p=6857"},"modified":"2018-04-26T09:38:53","modified_gmt":"2018-04-26T08:38:53","slug":"predicting-warpage-and-residual-stresses-of-3d-printed-parts","status":"publish","type":"post","link":"https:\/\/www.engineernewsnetwork.com\/blog\/predicting-warpage-and-residual-stresses-of-3d-printed-parts\/","title":{"rendered":"Predicting warpage and residual stresses of 3D printed parts"},"content":{"rendered":"Solvay<\/a><\/span>\u2019s high-performance KetaSpire PEEK AM filament will be the first polyetheretherketone polymer included in e-Xstream<\/a><\/span> engineering\u2019s Digimat simulation software due for launch in June 2018.<\/p>\n

Part of the latest edition of Digimat 2018.1, Digimat for Additive Manufacturing will enable designers and engineers to accurately predict warpage and residual stresses of 3D printed KetaSpire PEEK parts as a function of additive manufacturing processes, such as fused filament fabrication (FFF).<\/p>\n

With Digimat for Additive Manufacturing, users can further optimise their process and minimise part deformation before 3D printing their parts. Digimat 2018.1 is due for global release this June, but Solvay customers can contact Solvay<\/a><\/span> today to benefit from the new dataset describing KetaSpire PEEK\u2019s material laws.<\/p>\n

Thermoplastic polymers<\/strong><\/p>\n

Widely regarded as one of the highest-performing thermoplastic polymers, KetaSpire PEEK AM filament offers superior mechanical strength and chemical resistance for 3D printed parts.<\/p>\n

While Solvay\u2019s advanced PEEK polymer was historically limited to conventional processing methods, the newly launched KetaSpire PEEK AM filaments now make this material an option for additive manufacturing applications that demand a higher level of end-part performance.<\/p>\n

\u201c[highlight color=\"blue\"]Solvay<\/a><\/span>[\/highlight] \u2019s combination of industry-leading materials, expertise and collaborative innovation enabled us to develop highly accurate predictive modelling data for KetaSpire PEEK AM filaments,\u201d said Roger Assaker, CEO of e-Xstream engineering and chief material strategist for e-Xstream\u2019s parent company, MSC Software. \u201cAs a result, Digimat simulation software offers additive manufacturers cutting-edge new material options to push the design boundaries of their 3D-printed parts.\u201d<\/p>\n

\u201cKetaSpire PEEK\u2019s inclusion in Digimat represents Solvay\u2019s latest step toward becoming the industry\u2019s leading resource for successfully applying advanced polymers in 3D printing processes,\u201d said Christophe Schramm, business manager for additive manufacturing at Solvay\u2019s Specialty Polymers global business unit.<\/p>\n

\u201cSolvay is building on its long-standing partnership with e-Xstream engineering to quickly expand the number of specialty polymers available for simulation on the Digimat platform, and ultimately enable our customers to \u2018print it right the first time\u2019 when using Solvay\u2019s high-performing thermoplastics.\u201d<\/p>\n","protected":false},"excerpt":{"rendered":"

Solvay\u2019s high-performance KetaSpire PEEK AM filament will be the first polyetheretherketone polymer included in e-Xstream engineering\u2019s Digimat simulation software due for launch in June 2018. Part of the latest edition of Digimat 2018.1, Digimat for Additive Manufacturing will enable designers and engineers to accurately predict warpage and residual stresses of 3D printed KetaSpire PEEK parts …<\/p>\n","protected":false},"author":1,"featured_media":6859,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[105],"tags":[3822,317,486,3825,3823,3827,3826,3824,3821,3312,3771],"class_list":["post-6857","post","type-post","status-publish","format-standard","has-post-thumbnail","","category-design","tag-3d-printed-parts","tag-additive-manufacturing","tag-am","tag-digimat","tag-e-xstream-engineering","tag-fff","tag-fused-filament-fabrication","tag-ketaspire-peek-am","tag-simulation-solutions","tag-solvay","tag-solvay-specialty-polymers"],"yoast_head":"\nPredicting warpage and residual stresses of 3D printed parts - Engineer News Network<\/title>\n<meta name=\"description\" content=\"Solvay enables simulation solutions for high-performance 3D printed parts with software support from e-Xstream engineering\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.engineernewsnetwork.com\/blog\/predicting-warpage-and-residual-stresses-of-3d-printed-parts\/\" \/>\n<meta property=\"og:locale\" content=\"en_GB\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Predicting warpage and residual stresses of 3D printed parts - 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