{"id":9806,"date":"2018-11-21T08:00:45","date_gmt":"2018-11-21T08:00:45","guid":{"rendered":"https:\/\/www.engineernewsnetwork.com\/blog\/?p=9806"},"modified":"2018-11-20T11:23:42","modified_gmt":"2018-11-20T11:23:42","slug":"%e2%80%a8lora-system-in-package-family","status":"publish","type":"post","link":"https:\/\/www.engineernewsnetwork.com\/blog\/%e2%80%a8lora-system-in-package-family\/","title":{"rendered":"Accelerate development of remote IoT nodes with the \u2028LoRa System-in-Package family"},"content":{"rendered":"<p>Microchip announces a highly-integrated <span class=\"highlight highlight-blue\"><a href=\"https:\/\/www.microchip.com\/SAMR34\" target=\"_blank\" rel=\"noopener\">LoRa System-in-Package (SiP) family<\/a><\/span> with an ultra-low-power 32-bit microcontroller (MCU), sub-GHz RF LoRa transceiver and software stack.<\/p>\n<p>The combination of long-range wireless connectivity with low-power performance is designed to accelerate the development of LoRa-based connected solutions.<\/p>\n<figure id=\"attachment_9808\" aria-describedby=\"caption-attachment-9808\" style=\"width: 300px\" class=\"wp-caption alignnone\"><a href=\"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2018\/11\/MC1435-Image-SAMR34-hi.jpg\"><img loading=\"lazy\" decoding=\"async\" class=\"size-medium wp-image-9808\" src=\"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2018\/11\/MC1435-Image-SAMR34-hi-300x214.jpg\" alt=\"Accelerate development of remote IoT nodes with the\u2028 LoRa System-in-Package family\" width=\"300\" height=\"214\" srcset=\"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2018\/11\/MC1435-Image-SAMR34-hi-300x214.jpg 300w, https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2018\/11\/MC1435-Image-SAMR34-hi.jpg 504w\" sizes=\"auto, (max-width: 300px) 100vw, 300px\" \/><\/a><figcaption id=\"caption-attachment-9808\" class=\"wp-caption-text\">Industry-leading low power consumption from SAM R34\/35 LoRa System-in-Package (SiP)<\/figcaption><\/figure>\n<p>The SAM R34\/35 SiPs are supported by certified reference designs and proven interoperability with major LoRaWAN gateway and network providers, significantly simplifying the entire development process with hardware, software and support.<br \/>\n<script async src=\"\/\/pagead2.googlesyndication.com\/pagead\/js\/adsbygoogle.js\"><\/script><br \/>\n<ins class=\"adsbygoogle\" style=\"display: block; text-align: center;\" data-ad-layout=\"in-article\" data-ad-format=\"fluid\" data-ad-client=\"ca-pub-7565662001938327\" data-ad-slot=\"7585079586\"><\/ins><br \/>\n<script>\n     (adsbygoogle = window.adsbygoogle || []).push({});\n<\/script><br \/>\nThe devices also provide the industry\u2019s lowest power consumption in sleep modes, offering extended battery life in remote IoT nodes.<\/p>\n<p>Most LoRa end devices remain in sleep mode for extended periods of time, only waking occasionally to transmit small data packets.<\/p>\n<p>Powered by the ultra-low-power SAM L21 Arm Cortex-M0+ based MCU, the SAM R34 devices provide sleep modes as low as 790 nA to significantly reduce power consumption and extend battery life in end applications.<\/p>\n<figure id=\"attachment_9810\" aria-describedby=\"caption-attachment-9810\" style=\"width: 300px\" class=\"wp-caption alignnone\"><a href=\"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2018\/11\/MC1435-DIAG-SAMR34-hi.jpg\"><img loading=\"lazy\" decoding=\"async\" class=\"size-medium wp-image-9810\" src=\"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2018\/11\/MC1435-DIAG-SAMR34-hi-300x214.jpg\" alt=\"\" width=\"300\" height=\"214\" srcset=\"https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2018\/11\/MC1435-DIAG-SAMR34-hi-300x214.jpg 300w, https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2018\/11\/MC1435-DIAG-SAMR34-hi-768x549.jpg 768w, https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2018\/11\/MC1435-DIAG-SAMR34-hi-1024x732.jpg 1024w, https:\/\/www.engineernewsnetwork.com\/blog\/wp-content\/uploads\/2018\/11\/MC1435-DIAG-SAMR34-hi-800x572.jpg 800w\" sizes=\"auto, (max-width: 300px) 100vw, 300px\" \/><\/a><figcaption id=\"caption-attachment-9810\" class=\"wp-caption-text\">Development board certified with FCC, Industry Canada and Radio Equipment Directive<\/figcaption><\/figure>\n<p>Highly integrated in a compact 6 x 6 mm package, the SAM R34\/35 family is ideal for a broad array of long-range, low-power IoT applications that require small form factor designs and multiple years of battery life.<\/p>\n<p>In addition to ultra-low-power consumption, the simplified development process means developers can accelerate their designs by combining their application code with Microchip\u2019s LoRaWAN stack and quickly prototype with the ATSAMR34-XPRO development board (DM320111), which is supported by the Atmel Studio 7 Software Development Kit (SDK).<\/p>\n<p>The development board is certified with the Federal Communications Commission (FCC), Industry Canada (IC) and Radio Equipment Directive (RED), providing developers with the confidence that their designs will meet government requirements across geographies.<\/p>\n<p>LoRa technology is designed to enable low-power applications to communicate over longer ranges than Zigbee, Wi-Fi and Bluetooth using the LoRaWAN open protocol. Ideal for a range of applications such as smart cities, agricultural monitoring and supply-chain tracking, LoRaWAN enables the creation of flexible IoT networks that can operate in both urban and rural environments.<\/p>\n<p>According to the LoRa Alliance, the number of LoRaWAN operators has doubled from 40 to 80 over the last 12 months, with more than 100 countries actively developing LoRaWAN networks.<\/p>\n<p>The SAM R34\/35 family is supported by Microchip\u2019s LoRaWAN stack, as well as a certified and proven chip-down package that enables customers to accelerate the design of RF applications with reduced risk.<\/p>\n<p>With support for worldwide LoRaWAN operation from 862 to 1020 MHz, developers can use a single part variant across geographies, simplifying the design process and reducing inventory burden. The SAM R34\/35 family supports Class A and Class C end devices as well as proprietary point-to-point connections.<\/p>\n<span class=\"highlight highlight-blue\"><a href=\"https:\/\/www.engineernewsnetwork.com\/blog\/segger-supports-microchip-saml11-with-embos-rtos-and-advanced-development-tools\/\" target=\"_blank\" rel=\"noopener\">Microchip<\/a><\/span>\u2019s SAM R34\/35 LoRa family is available in six device variants, providing developers the flexibility to choose the best combination of memory and peripherals for their end application. SAM R34 devices offer a 64-lead TFBGA package and the SAM R35 devices are available without a USB interface.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Microchip announces a highly-integrated LoRa System-in-Package (SiP) family with an ultra-low-power 32-bit microcontroller (MCU), sub-GHz RF LoRa transceiver and software stack. The combination of long-range wireless connectivity with low-power performance is designed to accelerate the development of LoRa-based connected solutions. The SAM R34\/35 SiPs are supported by certified reference designs and proven interoperability with major &hellip;<\/p>\n","protected":false},"author":1,"featured_media":9808,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[],"class_list":["post-9806","post","type-post","status-publish","format-standard","has-post-thumbnail","","category-process"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Accelerate development of remote IoT nodes with the \u2028LoRa System-in-Package family - Engineer News Network<\/title>\n<meta name=\"description\" content=\"Microchip announces a highly integrated LoRa System-in-Package (SiP) family with an ultra-low-power 32-bit microcontroller (MCU), sub-GHz RF LoRa transceiver and software stack\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.engineernewsnetwork.com\/blog\/\u2028lora-system-in-package-family\/\" \/>\n<meta property=\"og:locale\" content=\"en_GB\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Accelerate development of remote IoT nodes with the \u2028LoRa System-in-Package family - 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