Engineer News Network The ultimate online news and information resource for today’s engineer
An economical yet versatile connector range with a multiplicity of configuration options, BergStak Lite is particularly well suited to high-speed, high-density parallel board stacking applications in IP phones, measurement equipment, point-of-sale (POS) terminals, portable industrial terminals, security systems and test equipment.
The Amphenol BergStak Lite system includes straight PCB headers and sockets with a choice of 40, 60, 80 or 100 contact positions arranged at 0.8 mm pitch in one to four rows.
A choice of 16 PCB stacking heights is available, in 1 mm increments from 5mm to 20mm.
Design engineers are thus provided with a consistent mating interface across a wide variety of formats to support evolving designs and mechanical requirements.
Depending on stack height, BergStak Lite can support data rates of up to 12 Gbit/s — compatible with PCIe version 3 and SAS 3.0 high-speed bus performance.
The 0.8 mm contact pitch conserves PCB space for high-density applications.
Economical gold flash plating on the contact areas supports 50 mating cycles, while a scoop-proof housing prevents terminal damage due to reverse mating.
Optional PCB locator pegs help ensure easy, accurate manual assembly. BergStak Lite has an operating temperature range from –40°C to +125°C and is available in a UL94 V-0 rated flame retardant LCP (liquid crystal polymer) material. It is RoHS compliant and lead free.
RS offers packaging options for BergStak Lite ranging from small packs to tape-and-reel for full-scale manufacture.
The Amphenol BergStak Lite system is shipping now from RS in the EMEA and Asia Pacific regions.
