Engineer News Network The ultimate online news and information resource for today’s engineer
Toshiba announces the very first customer shipment of a new 130nm manufacturing process node based FFSA (Fit Fast Structured Array) …
Read More »Toshiba unveils 130nm fit fast structured array development platform
Toshiba announces Bluetooth 5 IC for automotive applications
Toshiba Electronics Europe has announced a new Bluetooth IC for automotive applications will be added to their IC line-up. The …
Read More »Dual H-bridge driver IC for DC brushed motors and stepping motors
Toshiba Electronics Europe has announced the launch of a new dual H-bridge driver IC for DC brushed motors and stepping …
Read More »Automotive 40V ultra low RDS(ON) MOSFETs in 5mm x 6mm packages
Toshiba Electronics Europe announces the launch of TPWR7940PB and TPW1R104PB, 40V N-channel power MOSFETs using DSOP Advance (WF) packages with …
Read More »Low-power, high-speed microcontrollers
Toshiba Electronics Europe (TEE) announces the launch of the second M3H group in the TXZ family of low-power, high-speed microcontrollers …
Read More »Compact power MOSFET gate driver intelligent power device
Toshiba Electronics Europe announces the availability of a new compact power MOSFET gate driver intelligent power device (IPD) for automotive …
Read More »Low reverse-current Schottky diode with improved thermal performance
Toshiba Electronics Devices & Storage Europe announces the launch of its new Schottky barrier diode product CUHS10F60. The device is …
Read More »Active-clamp MOSFET series for relay drivers
Toshiba Electronics Europe has announced the launch of a new MOSFET series that incorporates an active-clamp structure with a built-in …
Read More »Toshiba announces evaluation board for three-phase BLDC motor drive ICs
Toshiba Electronics Europe announces a new evaluation board for its TPD420xF series of brushless DC (BLDC) three-phase motor driver ICs …
Read More »