Thermally conductive pads enhance electrical insulation

The Chomerics Division of Parker Hannifin announces the launch of its CHO-THERM HV Series, a new line of thermally conductive interface pads offering enhanced levels of electrical insulation. This range of materials combines high thermal dissipation performance and electrical isolation with inherent vibration damping properties. Thermal conductivity spans 1.1 to 3.3 W/m-K with breakdown voltages of up to 20kV under DC load.

To improve electrical insulation between high-power components, the CHO-THERM HV Series incorporates robust dielectric layers. Alongside impressive thermal performance, these properties are designed to meet the stringent engineering demands of modern automotive and industrial systems. The materials exhibit dielectric constant as low as -0.05 at 1MHz (ASTM D150 test method) and dissipation factor down to 2.8 at 1MHz (Chomerics CHO-TM-TP13).

CHO-THERM HV is also suited to alternative energy power conversion/inversion systems, heavy-duty industrial equipment and industrial motor controllers. Parker Chomerics engineered the materials to provide effective thermal transfer from heat-generating components such as CPUs, GPUs and high-power busbars to heat-dissipating components like cold plates, heatsinks, cooling pipes and vapour chambers.

Additional benefits extend to minimal outgassing, V-0 flammability compliance under the globally recognised UL94 standard and ultra-low compression force characteristics that simplify installation. With Shore 00 hardness ratings of 30–35, CHO-THERM HV solutions conform readily to uneven or textured mating surfaces, eliminating air gaps and improving thermal contact.

Customers can now specify the pads in standard sheet formats for high-volume processing or select custom die-cut configurations tailored to complex geometries. Four RoHS-compliant material variants are available, with specialists from Parker Chomerics ready to assist with the optimal selection. PSA (pressure-sensitive adhesive) bonding options are available where added adhesion strength is necessary.