Why thermal interface materials are indispensable in thermal management

CTX Thermal Solutions has expanded its portfolio with Thermal Interface Materials (TIM) for heat dissipation in electronic components. The manufacturer supplies the thermal interface materials precisely cut to size and, if desired, pre-assembled with the heat sink already included. CTX offers TIM for heat sinks from all vendors.

Thermal interface materials improve the thermal contact between the heat sink and the electronic component. The surfaces of the heat sinks have microscopic bumps that cause insulating air pockets upon direct contact with the electronics. These air pockets impair heat transfer. Thermal interface material fills in the bumps and displaces the air, improving thermal contact and reducing thermal contact resistance. The resulting heat loss can thus be dissipated more efficiently into the heat sink.

Materials can be selected to match the application.

CTX Thermal Solutions offers a wide range of thermal interface materials that can be selected based on such properties as thickness, thermal conductivity or dielectric strength. The foremost materials include thermal pads, gap fillers, and graphite foils.

• Usually made of silicone, thermal pads are electrically insulating and mechanically adaptable; their thermal conductivity ranges between about 1 and over 10W/mK, depending on the material.
• Gap fillers are elastic thermal interface materials that are particularly suitable for bridging larger gaps measuring several millimeters. Depending on their application, customers can choose from silicone-containing and silicone-free variants. A secure positive fit allows it to achieve a thermal impedance of less than 0.66Kcm²/W.
• Graphite foils have a low thermal resistance of up to 0.52Kcm²/W. They are electrically conductive and temperature-resistant up to several hundred degrees Celsius.

Applying their own stamping technology, CTX produces blanks of the thermal interface materials according to drawing specifications. They are delivered loose, packed on mats or in blister trays and, if desired, pre-assembled with the heat sink. If requested, the manufacturer will provide their assistance with the design and establish the suitable material and its geometry on the basis of the customer’s thermal data. Users benefit from the company’s experience in the design and manufacture of all types of heat sinks. CTX manufactures thermal interface materials for heat sinks made by all manufacturers.

The products offered are geared towards manufacturers of power electronics in various areas of application. Typical examples are LED modules in electromobility, inverters for the conversion of renewable energies, switched-mode power supplies for power supply and diagnostic systems with high-performance processors used in medical technology. In all applications, from 24/7 use in power supply to confined installation spaces with high power density in electromobility, thermal interface materials from CTX support trouble-free operation with minimal power loss.