Home / Electronics / High speed communication in automotive applications

High speed communication in automotive applications

Toshiba Electronics Europe has unveiled the TLX9310, a low power consumption photocoupler housed in a 5-pin 3.7mm x 7.0mm x 2.2mm SO6 package.

The new device is intended for high-speed communication in automotive applications, especially Battery Management Systems (BMS).



Integration of a high-power infrared LED and high-gain, high-speed photo IC chip reduces power consumption to below 25% of Toshiba’s current devices (TLX9304, TLX9376, TLX9378) both during standby and active use in automotive applications. Supply current is just 0.3mA.

The TLX9310 provides high levels of safety isolation with 5.0mm (min.) creepage / clearance distances and a 3.75kVrms (min.) isolation voltage.

The low propagation delay of 250ns (max.) permits use in high-speed communication systems.

The operating temperature range of -40°C to +105°C makes the photocoupler ideal for demanding automotive applications.

Check Also

High-speed and flexible code reading for industrial traceability

Leuze expands its portfolio with the DCR 100i series, a compact code reader designed for …

Protection Zener diodes portfolio has four new voltage ratings up to 75V

Toshiba is expanding its surge protection Zener diodes lineup with the addition of four new …

Confocal distance and thickness measurement sensors withstand temperatures up to 200 °C and are vacuum-compatible

Precision sensor supplier Micro-Epsilon has extended its range of confocal chromatic distance and thickness measurement …

Leave a Reply

Your email address will not be published. Required fields are marked *