Automated test platform accelerates high-volume silicon photonics and co-packaged optics manufacturing

Teradyne has launched of the Photon 100, a comprehensive opto-electric automated test platform purpose-built to accelerate high-volume silicon photonics (SiPh) and co-packaged optics (CPO) manufacturing.

As demand for high-speed, energy-efficient optical interconnects surges, driven by AI and next-generation data centers, manufacturers face challenges in scaling SiPh and CPO to high volume manufacturing. By integrating industry-leading optical and electrical instrumentation with Teradyne’s proven UltraFLEXplus platform, Teradyne Photon 100 enables high-throughput, automated testing across all key manufacturing stages, including wafer, optical engine, and co-packaged module insertions. This solution simplifies operations, accelerates time-to-market, and enables rapid scaling for silicon photonics and co-packaged optics manufacturing.

Key Features and Benefits

• Integrated Optical & Electrical Instrumentation: Combines advanced optical and electrical test capabilities.
• Scalable for High-Volume Manufacturing: Designed to support the rigorous demands of high-volume SiPh and CPO production environments.
• Comprehensive Test Coverage: Supports wafer (single and double-sided), optical engine, and CPO test insertions.
• Customisable Optical Instrumentation: Standard configuration available, with the ability to tailor optical instrumentation if needed.
• Operational Simplicity: Designed, built and maintained by Teradyne, eliminating the need for customers to integrate and support multi-vendor solutions.
• Open Ecosystem: Customers can choose their preferred ecosystem partners for high-volume manufacturing, including wafer-level and die-level probe options.