Fieldbus modular remote I/O series supports digital transformation

Dinkle International announces North American availability of its iO-GRID X modular remote I/O family. The iO-GRID X series is a modular and adaptable platform for original equipment manufacturers and factory automation integrators to incorporate digitalisation into machines and systems.

Remote input/output (I/O) solutions reduce wiring labor, minimise control panel space requirements, lower material costs, and offer improved control system scalability. Remote I/O is a leading technique for connecting field devices such as sensors, actuators, and other monitoring/control devices with minimal wiring, and it requires only a single network connection and power circuit to each station location. Almost any application and industry can benefit from remote I/O, including machinery, automated manufacturing and logistics, building automation, and more.

By choosing the capable iO-GRID X platform, designers can realise benefits of mixing-and-matching modular slice-type I/O to support various field requirements, while using their preferred micro controller, PLC, or other host system.

The iO-GRID X fieldbus coupler modules support major industrial Ethernet communications protocols at up to 100Mbps, including EtherCAT, EtherNet/IP, PROFINET, Modbus TCP, and CC-Link IE Field Basic. Each interface module includes two RJ45 interface plugs and an integrated two-port Ethernet switch for convenient station expansion using daisy-chain cabling. LED indicators provide clear operational status information, and the module accepts firmware upgrades using a standard USB Type C connection.

Over 20 types of I/O modules are available, accommodating varying I/O counts and signal types, with integrated indicator lights for easy identification of channel status. Key specifications include:

· Discrete input and output modules are available in 16- or 32-channel sinking or sourcing versions, with either push-in connections or 34-pole IDC connectors.

· Analogue input and output modules are available in 4- or 8-channel voltage or milliamp current versions, with 12- or 16-bit resolution.

· Resistance temperature device (RTD), thermocouple (TC), serial communication, high-speed counter (HSC), and pulse output modules are also available to cover the needs for most any application.

Modules operate throughout a wide ambient temperature range of -10 to +60DegC, and they mount securely to DIN rails with a reliable mechanical and grounding connection, while gold-plated spring-loaded connectors ensure positive module-to-module connectivity. Two power supply sizes are available to handle varying I/O counts, both accepting standard 24 VDC. All models are CE and UL certified.

Detachable terminal blocks and convenient push-in design ensure quick module replacements without rewiring, along with easy expansion of existing installations. Push-in terminal blocks require no tools for wiring completion, and large wire entries ease installations. IDC connectors provide a high-density wiring option.

Daudin remote I/O solutions, including iO-GRID X, help systems integrators and equipment builders create more efficient and flexible control systems. Standard products address most applications, and Daudin also offers customisation options via extensive hardware, firmware, software, labeling, branding, and application-specific design capabilities. Daudin is committed to collaborating with end users to create innovative solutions for intelligent and connected power, networking, and communications designs.