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Ageing analysis enables accurate prediction of product wear-out
The new ageing model in Cadence Legato Reliability Solution accurately predicts wear-out by analysing ageing acceleration due to temperature and process variation

Ageing analysis enables accurate prediction of product wear-out

Cadence Design Systems’ debuts first analogue IC design-for-reliability solution addresses reliability challenges across the product lifecycle for automotive, medical, industrial, aerospace and defence applications.

Cadence Design Systems’ Cadence Legato Reliability Solution is the industry’s first software product that meets the challenges of designing high-reliability analogue and mixed-signal integrated circuits (ICs) for automotive, medical, industrial, and aerospace and defence applications.

Ageing analysis enables accurate prediction of product wear-out
The Cadence Legato Reliability Solution simulates on-chip temperature rise and operation to prevent thermal overstress

The Legato Reliability Solution provides analogue designers with the tools they need to manage their design’s reliability throughout the product lifecycle, from initial test through active life through ageing.



Based on the Cadence Spectre Accelerated Parallel Simulator and the Cadence Virtuoso custom IC design platform, the Legato Reliability Solution integrates capabilities into an intuitive cockpit to address the reliability concerns of the three phases of the product lifecycle:

* Analogue defect analysis accelerates analog defect simulation by up to 100X, reducing test cost and eliminating test escapes, the main source of early failure in IC designs

* Electro-thermal analysis avoids premature failures due to thermal overstress during the product’s useful life

* Advanced ageing analysis enables accurate prediction of product wear-out by analysing ageing acceleration due to temperature and process variation.

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