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The latest trend within mobile handset design is to extend the screen to the very edge of the case, even …
Read More »3D force sensing enables true edge-to-edge mobile displays
Entry-level thermal imaging camera
FLIR Systems announces the FLIR E53 – the latest addition to the Exx-Series of advanced thermal imaging cameras for electrical, …
Read More »Multi-mode connectivity board supports LTE CAT NB1, M1 and E-GPRS
Avnet Silica announces a new development board that delivers next-generation, low‑power wide‑area (LPWA) connectivity that targets use in machine-to-machine (M2M) …
Read More »Metal alloy resistors are AEC-Q200 qualified
TT Electronics has announced the LRMAP5930 series of low resistance, metal alloy current sense power resistors. With values down to …
Read More »New low power, fully compliant USB-C 1.3 devices from ON Semiconductor
ON Semiconductor has announced the latest set of USB-C (Type-C) devices that are fully compliant with the latest revision 1.3 …
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