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In a digital age, where we store practically all of our most sensitive information in our pockets, the danger of …
Read More »Mobile robots: 3D ultrasonic collision avoidance sensor
Tech start-up Toposens is announcing the market launch of its first commercial Toposens 3D ultrasonic collision avoidance system, for mobile …
Read More »On-wafer device characterisation test solution
Rohde & Schwarz now offers a test solution for full RF performance characterisation of the DUT on-wafer which combines the …
Read More »Digital solutions to help reduce stress for factory-based employees
According to the US Bureau of Labor Statistics, the manufacturing industry experienced the second-largest increase in resignation rates in 2021, …
Read More »Connectors deliver greater board-to-board spacing
To support the complete breadth of customer applications, Harwin adds another option to its Datamate series of high-reliability (Hi-Rel) connectors. …
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