ifm has introduced the LDL3x1 conductivity sensor, a new generation of analytical sensor built for applications where the highest standards …
Read More »Power device delivers 20A of continuous current in a compact form factor for new space and traditional space applications
Microchip Technology announces the POL-05-20S-T, a radiation-tolerant, Point-of-Load (POL) converter, designed to address the demanding power requirements of space processing …
Read More »Platform engineered to maximise semiconductor manufacturing for edge AI applications
Teradyne‘s UltraFLEXplus S series is an extension of its UltraFLEXplus platform engineered to maximise output per square metre and operational …
Read More »Thermal imaging camera delivers 1280 × 1024 HD resolution
Teledyne FLIR announces the launch of the A8481, a new compact HD MWIR science camera designed for researchers and engineers …
Read More »Ultra-fast AI inference at 10GSPS detects particle pile-up in real time
FPGA-based AI inference at 10 giga samples per second (GSPS) on the Teledyne ADQ35 enables reliable and accurate particle localisation …
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