As AI workloads continue to scale, data centre architects are increasingly constrained by limited signal reach and rising latency, which …
Read More »3.3kV HV‑D3 mSiC power modules to enable solid-state transformers for AI data centres
Microchip Technology announces the availability of its new 3.3 kV HV‑D3 mSiC Power Modules, designed to simplify and accelerate the …
Read More »Dynamic inclination sensors with IO-Link
ifm has announced the launch of its new JBC series dynamic inclination sensors, providing a highly accurate angle measurement solution for …
Read More »Integrates on-chip DC/DC power to simplify LIN RGB automotive lighting
Melexis announces the MLX81119, an 18-channel LIN RGB LED controller with an integrated DC/DC converter, designed to simplify and optimise …
Read More »Network connectivity vital for edge AI applications
Innodisk, launches its High-Speed 10GbE LAN Series, a portfolio of LAN modules built to address the growing networking demands of edge …
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