KEMET has launched a new family of metal composite power inductors to address the stringent demands of the automotive market. …
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Toshiba expands 32-bit microcontroller line-up
Toshiba Electronics Europe GmbH has announced expansions to its a line-up of microcontrollers. The TXZ+ family is a new range …
Read More »Overcoming metrology bottlenecks in additive manufacturing
Eric Felkel looks at the subject of metrology solutions for additive manufacturing when used in production applications Undoubtedly there are …
Read More »Online calculator removes barriers to storing industrial data
Industrial data specialist Novotek UK and Ireland has launched an online calculator to help engineers and plant managers calculate the …
Read More »Designing bespoke power solutions for demanding applications
Simone Bruckner discusses the considerations when designing power resistors for unique applications Entrepreneur Henry Ford’s automotive legacy may seem everlasting, …
Read More »New dates confirmed for Plastics Recycling Show Europe: 27th-28th October 2020
The organisers of the Plastics Recycling Show Europe (PRSE) have confirmed that the 2020 event has been rescheduled to take …
Read More »Advanced textiles create materials that improve performance, structure and strength
New materials increase part functionality, utility and product differentiation. Joe Melcher, Patty Berghardt and Shawn Benfield report The advanced technical textile …
Read More »Compact, high efficiency secure power from AC or DC inputs
PULS Power’s latest addition to its Dimension CP Series is a ruggedised unit featuring an integrated high efficiency MOSFET based …
Read More »Safety light grid has muting built in
The latest OY510 series of safety light grids from ifm electronic Ltd feature an integrated T-muting option for use in …
Read More »How manufacturers can optimise performance and manufacturability for additive manufacturing
Alexander Pluke advocates adopting a multi-functional approach simultaneously considering material properties, geometry, and material placement, hardware systems, and build parameters …
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