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IoT prototyping kits

Offering flexible platforms with Wi-Fi, Bluetooth and BLE connectivity and PSoC 6 MCUs for IoT development

RS Components has announced availability of two new PSoC 6 prototyping kits from Cypress Semiconductor Corp – the first for Wi-Fi and Bluetooth IoT development and the second for BLE (Bluetooth Low Energy) based IoT applications.

Along with advanced connectivity, the two kits offer a low-cost hardware development platform that enables designs based around the ultra-low-power dual-core-architecture Cypress PSoC 6 microcontroller.


The PSoC 6 MCU integrates built-in security, up to 2MB of flash memory and 1MB of SRAM, together with an Arm Cortex M4 for high-performance tasks and a Cortex-M0+ for low-power tasks, all on a single chip.

The PSoC 6 Wi-Fi-/BT prototyping kit combines the PSoC 6 MCU with industry-leading connectivity via an on-board module hosting the Cypress CYW4343W combo chipset, which provides 802.11b/g/n Wi-Fi and dual-mode Bluetooth 4.1 connectivity.

The kit provides a snap-away form factor, giving developers flexibility to use different peripherals to design and prototype IoT applications.

It also offers Cypress’ industry-leading CapSense capacitive touch sensing technology, as well as a 512MB Quad-SPI NOR flash device, a MicroSD card slot, and a Digilent Pmod interface.

The second offering is the PSoC 6 BLE prototyping kit, which provides the CYBLE-416045-02 EZ-BLE Creator Module (based on the PSoC 63 MCU).

This module is fully certified for Bluetooth 5.0 and provides a programmable turnkey solution for developers to add Bluetooth connectivity to IoT designs. It comes with a royalty-free BLE stack and provides 36 GPIOs in a 14 x 18.5 x 2.00mm package.

The kit is also designed with a snap-away form-factor, which allows the separation of the on-board programmer and debugger (KitProg2) from the target board. It also provides a mikroBUS interface allowing interfacing of the MCU with any of MikroElektronika’s 500+ click boards.

Both kits are shipping now from RS in the EMEA and Asia Pacific regions.

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