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  • India to account for 20% of global plastics capacity additions by 2030
  • True-colour recognition controller now includes the LCh colour space
  • FR1–FR3 carrier aggregation
  • Enclosure assembly: why external support can save time and costs
  • Switching 4mm banana socket
  • UK green hydrogen market set to reach £30-£90bn by 2050
  • World Engineering Day: an industry in transition
  • Phosphate analyser for water treatment facilities
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  • Solving cavitation challenges 
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  • Enclosures for concrete: streamlining electrical installation to meet demanding construction schedules

Pressure sensor for automotive applications such as EV thermal management

11th September 2024 Electronics Comments Off on Pressure sensor for automotive applications such as EV thermal management 805

Melexis expands its Triphibian family with the MLX90834 pressure sensor, designed for automotive applications such as EV thermal management. This …

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Fluidised bed drying: elevating control strategies

11th September 2024 News, Views and Opinion, Process Comments Off on Fluidised bed drying: elevating control strategies 1,409

Alan Messenger looks at how manufacturers and processors can advance their fluidised bed dryers to enhance competitiveness and profitability The …

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Controls protected with polycarbonate enclosures

10th September 2024 Design, Process Comments Off on Controls protected with polycarbonate enclosures 692

In a modern dairy farm setting, automation is crucial. Electronic control increases efficiency, reducing the dependence on human resources, and …

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All-band GNSS antenna for high-precision applications

10th September 2024 Electronics Comments Off on All-band GNSS antenna for high-precision applications 1,694

u-blox has announced the external GNSS antenna ANN-MB2 for wide coverage, multi-constellation high-precision applications. Optimised for the u-blox high-precision GNSS …

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2D cameras for positioning and inspecting ultra-fine wires in semiconductor production

9th September 2024 Design, Electronics Comments Off on 2D cameras for positioning and inspecting ultra-fine wires in semiconductor production 789

Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometres are …

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