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Providing superior heat dissipation while still maintaining small footprint size

Automotive planar Schottky diodes in space-saving CFP3-HP packaging

Nexperia is now offering a portfolio of 22 new planar Schottky diodes in CFP3-HP packaging. The portfolio includes 11 industrial, as well as 11 AEC-Q101 qualified products. This release supports the growing trend for manufacturers to replace devices in SMx-type packaging with smaller footprint CFP-packaged devices, especially in automotive applications. These diodes are suitable for use in, for example, DC-DC conversion, freewheeling, reverse polarity protection and OR-ing applications.

For maximum design flexibility, device options in this portfolio are offered with reverse voltages VR(max) ranging from 30 V to 100 V and forward currents IF(average) between 1A and 3A. The exposed heatsink, which is a feature of the CFP3-HP, enables it to provide the highest level of heat dissipation (Ptot) for such a small package footprint (3.7mm x 1.8mm x 0.9mm).

Utilsing the proprietary copper clip design, these packages meet the challenging demands of efficient and space-saving designs. Today, CFP packaging is used by different power diode technologies such as Nexperia’s Schottky and recovery rectifiers but can also be extended to bipolar transistors. It offers significant product diversity.

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