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A new method of creating bendable silicon chips could help pave the way for a new generation of high-performance flexible …
Read More »Silicon breakthrough could lead to high-performance bendable electronics
Power-on-Package system provides up to 1,000A peak current
Vicor Corporation announces a new Power-on-Package (PoP) ChiP-set including Modular Current Multipliers (MCMs) for high performance GPU, CPU, and ASIC …
Read More »Raspberry Pi computer board delivers more processing and faster communications
RS Components (RS), and Allied Electronics & Automation announce availability of the latest Raspberry Pi computer board: Raspberry Pi 3 …
Read More »Developing complex multi-architecture IoT applications
Arduino announces the expansion of the number of architectures supported by its Arduino Create platform With this new release, Arduino …
Read More »Sensors withstand extreme temperatures, pressures and aggressive chemicals
Will Meenan details the different types of sensors needed for corresponding extreme conditions It takes an extremely durable design to …
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