Following the release of Intel’s new 11th Gen Intel Core and Intel Atomx6000E Series processors, embedded computing specialist Recab UK is offering new computer-on-modules (COMs) from congatec to the UK market. Recab UK will provide baseboard and system designs based on the new congatec modules in a range of form factors, including the new COM high-performance computing (COM-HPC) standard.
Two new ranges of congatec COM boards and modules are available through Recab UK. The Intel Atom x6000E Series (code name: Elkhart Lake) processor-based range is available in SMARC, Qseven, COM Express Compact and Mini form factors, as well as on Pico-ITX single board computers (SBCs).
Each product benefits from the low-power 10nm technology of the Intel Atom x6000E processors, as well as doubled graphics performance for up to 2x 4k and 50% higher multi-thread computing power compared to their predecessors on up to four cores.
The other range of COMs is based on 11th Gen Intel Core processors (code name: Tiger Lake).
The new modules offer significantly greater CPU performance and nearly three times higher GPU performance, along with state-of-the-art PCIe Gen4 and USB4 support. In addition, the 11th Gen COM series features Intel Iris Xe graphics, delivering performance that is almost three times greater than predecessor modules based on 8th Gen Intel Core processor technology.
“There is a continually growing need for high performance, low energy computing in edge applications,” says Martin Frederiksen, managing director of Recab UK. “Whether these are fanless edge systems in harsh industrial or rail environments, or real-time network systems in the water industry, COMs have long been the go-to choice for edge applications.
“The new boards and modules from congatec allow for even greater computing power in edge applications, providing vast improvements to graphics-intensive processes such as medical imaging, security video stream analysis and immersive digital signage. They also support real-time operation, connectivity and hypervisor technologies, which are invaluable in modern Internet of Things (IoT) applications.
“As with all COM-based systems, effective baseboard design is imperative to ensure that systems perform as efficiently and effectively as possible. We’ll be leveraging our extensive experience in baseboard design for connected embedded systems, alongside our network of market-leading partners, to ensure system engineers in the UK can make the most of this next generation COM technology.”
Both the 11th Gen Intel Core and Intel Atom x6000E Series boards and modules from congatec have native extended operating temperatures from -40 to +85˚C, making them ideal options for harsh environments that require ruggedised systems.
Both product ranges also feature Intel Time Coordinated Computing (Intel TCC) technologies and in-band error correction codes, which help meet the exacting demands of critical real-time computing applications.