October, 2023

• 2 October

  Next generation e-MMC Ver. 5.1-compliant embedded flash memory products

  

  KIOXIA Europe GmbH announces sampling[1] of new, higher performing JEDEC e-MMC Ver. 5.1[2] compliant embedded flash memory products for consumer …

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• 2 October

  Asia to lead global methylene diphenyl diisocyanate capacity additions by 2027 

  Asia is set to lead the global methylene diphenyl diisocyanate (MDI) industry capacity additions with a share of 74% by …

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September, 2023

• 29 September

  Easy scale-up of new powder drying processes 

  

  Whether for new compounds or the development of cleaner, more efficient processes for existing molecules, scale-up is a crucial step …

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• 29 September

  Power and utilities industry embraces tech advancements for resilient energy infrastructure

  In the dynamic landscape of the power and utilities industry, power lines are witnessing a paradigm shift driven by technologies …

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• 29 September

  Gearhead minimises heat and enhances efficiency in applications requiring medium torque output

  

  Portescap introduces the new R22T cohort, the latest addition to its existing 22mm gearbox portfolio. As a mid-torque gearhead, the …

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• 29 September

  Miniature medically approved AC-DC modules offer up to 40W of power with easy integration

  

  XP Power announces the release of a family of single output, PCB mounting AC-DC power modules with power ratings from …

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• 28 September

  Load banks ensure back-up batteries are up-to-scratch

  Few sectors are more important than telecommunications. Responsible for keeping us connected with people, businesses and public services, keeping telecom …

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• 28 September

  Rust-resistant, rugged, or lightweight hand wheels

  

  WDS Components Ltd (WDS) responds adeptly to the needs of machinery manufacturers by offering a diverse range of material choices, …

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• 28 September

  Ultra-compact module for applications requiring medium data rates

  

  u-blox has announced its LEXI-R10, an ultra-small LTE Cat 1bis IoT module in a 16 x 16mm form factor. The …

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• 27 September

  Low pin count MCU family with I3C support

  

  With the step-function increase in data collected and transmitted from cloud-connected edge nodes, Improved Inter Integrated Circuit (I3C) is rapidly …

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