The food and beverage industry is continually evolving, driven by the need for enhanced efficiency, quality, and safety. Central to …
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September, 2024
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13 September
Automotive qualified small-signal MOSFETs in DFN1110D-3 and DFN1412-6 packages
Nexperia announces the release of single and dual small-signal MOSFETs in miniature DFN packages. The automotive qualified devices are available …
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13 September
3kW programmable power supplies offer constant voltage and constant current operation with single or three-phase inputs
TDK Corporation announces the introduction of the 3000 watt TDK-Lambda brand HWS3000 programmable AC-DC power supplies in a 270 x …
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12 September
On-site oxygen generators
For industrial operations that require oxygen, self-producing the gas is a reliable and cost-efficient solution. An on-site oxygen generator gives …
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12 September
Automotive-compliant, Hall effect ICs for proximity detection
Diodes Incorporated announces the addition of two enhanced high-voltage, Hall effect switch IC families to its automotive-compliant* product portfolio. The …
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11 September
Pressure sensor for automotive applications such as EV thermal management
Melexis expands its Triphibian family with the MLX90834 pressure sensor, designed for automotive applications such as EV thermal management. This …
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11 September
Fluidised bed drying: elevating control strategies
Alan Messenger looks at how manufacturers and processors can advance their fluidised bed dryers to enhance competitiveness and profitability The …
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10 September
Controls protected with polycarbonate enclosures
In a modern dairy farm setting, automation is crucial. Electronic control increases efficiency, reducing the dependence on human resources, and …
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10 September
All-band GNSS antenna for high-precision applications
u-blox has announced the external GNSS antenna ANN-MB2 for wide coverage, multi-constellation high-precision applications. Optimised for the u-blox high-precision GNSS …
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9 September
2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometres are …
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