Epoxy potting compound with excellent flow properties

UK adhesive specialists Techsil has launched a new potting compound for electronics with medium viscosity and small filler particle size: Structalit 5894-1 is a suitable choice for large-volume potting or glob top sealing of power electronics.

Structalit 5894-1 is a black, one part epoxy resin which requires no mixing. The combination of optimised viscosity and the small particle size of its fillers means it flows well and makes an excellent electrical potting compound. 

As an additional benefit, the low filler weight makes this potting epoxy less abrasive during application.

Structalit 5894-1 cures rapidly when exposed to heat, which allows faster processing of large volume electronic component potting and sealing. 

Once cured, the epoxy encapsulant provides a smooth and level surface which is, at the same time, shock and scratch resistant.