Embedded World 2018: Silicon Labs unveils advances in Wi-Fi, Bluetooth Mesh, Multiprotocol Technology and Cloud Connectivity

Silicon Labs will showcase a variety of low-power wireless connectivity solutions for smart homes, building automation, lighting, metering and other Internet of Things (IoT) applications at Embedded World 2018.

Hands-on demonstrations at Silicon Labs’ Booth 4A-128 will highlight the company’s new low-power Wi-Fi portfolio, Bluetooth mesh and Bluetooth 5 software, 802.15.14 Zigbee/Thread mesh solutions, multiprotocol support for Bluetooth to sub-GHz proprietary networks, secure device-to-cloud connectivity and digital isolation technology to protect embedded systems.



Silicon Labs offers the industry’s most comprehensive wireless connectivity portfolio for the IoT in standalone and multiprotocol configurations. With 15 years of mesh networking experience and more than 100 million deployed nodes, Silicon Labs is at the forefront of bringing multiprotocol wireless solutions to market.

Silicon Labs is also a leader in Bluetooth innovation, delivering ultra-small Bluetooth system-in-package (SiP) modules and SoCs that support Bluetooth LE commissioning and Bluetooth mesh connectivity. Silicon Labs Demos at Booth 4A-128, 27th February – 1st March 2018 at the Nuremberg, Germany.