High-voltage reconstituted mica capacitors

Next-Generation SMD High Voltage Mica Capacitors: CM-HVLP Power, easy integration, and Miniaturization

Exxelia announces the introduction of a new generation of high-voltage reconstituted mica capacitors designed to combine pulse and filtering capabilities within a compact SMD package.

The new CM-HVLP series (High-Voltage Low-Profile Reconstituted Mica Capacitors) addresses growing demand for high-voltage, robust, and low-profile components in volume-constrained electronic systems.

The new capacitors are engineered to meet the requirements of applications where high voltage handling, fast charge/discharge cycles, and reliability under repetitive stress are essential. Their design enables use in both pulse applications—such as charge and discharge circuits—and high-voltage filtering functions, offering a versatile solution for advanced electronic architectures.

The CM-HVLP series combines the intrinsic stability of reconstituted mica dielectric technology without any drift under voltage of the capacitance value and a breakthrough compact SMD footprint, supporting the ongoing miniaturization of high-power electronic systems. The capacitors provide high energy density, very low Equivalent Series Inductance (ESL), and the capability to withstand extreme dV/dt rates, enabling ultra-fast discharge performance even under intensive repetitive cycles. The design is also optimised to propose low ESR value.

Space heritage and extreme reliability

Building on our demonstrated historical experience with Space QPL family lines, Exxelia is now extending this expertise to diversify markets (Defense, Space, New Space, Medical, Industry, Aviaton). To ensure mission-critical reliability, qualification tests are performed according to the most stringent MIL standards, including:

• Mechanical: Severe shock and vibration profiles.
• Thermal: Extreme temperature cycling ranging from -55°C to +125°C.
• Long endurance life-test

Unmatched miniaturisation

Designed with integration in mind, the components feature a reduced footprint that facilitates placement in dense PCB layouts. The series offers a significant size advantage, with a format (8080) measuring only 20x20mm. This balance between miniaturization and power capability makes the technology particularly relevant for Space, Aerospace, Defense, Medical, and Aviation systems, where reliability and electrical stability are critical.

Technical specifications

• Capacitance range: From 10 nF to 750 nF
• Voltage range : 2 500 V_DISCH to 5 000 V_DISCH / 1 500 V_DC to 4 000 V_DC
• Dissipation Factor (Tg δ) : ≤ 50.10^-4 at 1 kHz
• Insulation resistance under 500 V : for C ≤ 0.22µF , IR ≥ 25000MΩ
for C ≥ 0.22µF , IR ≥ 5000MΩ.µF
• Dielectric Withstanding Voltage 1.4 V_DC
• Insulation between leads and case under 500V ≥ 25 000 MΩ