27th April 2018DesignComments Off on Predicting warpage and residual stresses of 3D printed parts2,257
Solvay’s high-performance KetaSpire PEEK AM filament will be the first polyetheretherketone polymer included in e-Xstream engineering’s Digimat simulation software due …
26th April 2018ElectronicsComments Off on SmartEverything Tiger board for low-power, multiprotocol wireless devices1,609
Arrow Electronics has extended its SmartEverything family with the Tiger board, featuring the NXP Semiconductors Kinetis KW41Z multi-protocol wireless MCU …