Home / Show Time / Toshiba develops 4.5kV press-pack IEGT with improved rupture resistance
Toshiba develops 4.5kV press-pack IEGT with improved rupture resistance
New packaging design provides 1.7 times higher rupture resistance than conventional press-pack packaging

Toshiba develops 4.5kV press-pack IEGT with improved rupture resistance

Toshiba Electronics Europe will be providing details on its new packaging for its 4.5kV class press-pack IEGT (PPI) devices at PCIM 2018 in Nürnberg.

The new packaging has been developed to further improve the rupture resistance of the device, thereby reducing the likelihood of damage to surrounding components and systems in the event of device failure.



The package is the result of research undertaken to evaluate the optimum volume ratio of materials in such packaging.

Through experimentation the optimal ratio was determined where neither destruction of the ceramic, nor material leakage occurred.

After careful measurement, the package was shown capable of withstanding 50 hours of short-circuit failure mode (SCFM). The experiment was executed with one shorted IEGT chip, out of 42 IEGT chips, in a worse-case edge location.

In addition, the rupture resistance tests, undertaken at a 3200 V test condition, resulted in 1.7 times higher resistance than that of standard PPI devices.

The outcomes of the research will be presented at the PCIM Europe 2018 Conference by Raita Kotani and Georges Tchouangue on Thursday, 7th June at 11:15am

Check Also

China’s ‘silicon valley’ set to accelerate semiconductor innovation

China is planning a ‘Silicon Valley’ to rival that of the west and this is …

Embedded world 2019: How engineers can turn ideas into reality

Embedded World 2019: How engineers can turn ideas into reality

RS Components (RS) will be presenting its newest products and innovations and some of the …

Blackhill Engineering achieves ISO 45001

Blackhill Engineering, the heavy engineering division of SC Group, has recently been certified to the …