Home / News, Views and Opinion / Advancing automotive mobility and internet of things platforms

Advancing automotive mobility and internet of things platforms

ON Semiconductor has announced its participation in the start-up ecosystem of Silicon Valley-based Plug and Play, the global innovation platform.

They join Plug and Play’s Mobility and Internet of Things (IoT) platforms, further showcasing their commitment towards advancing the widespread deployment of solutions in the automotive and industrial spheres.



“Customers are increasingly relying on us for key enabling technologies which are disrupting existing business models, said Mamoon Rashid, senior vice president of strategic business ventures at ON Semiconductor.

“We must innovate faster by incorporating a strategy of internal and external technology development. Partnering with innovation accelerators such as Plug and Play provides us a way to efficiently evaluate and consult new technologies and integrated them earlier into the ON Semiconductor portfolio.”

ON Semiconductor’s node-to-cloud environment for the IoT solves customer challenges in prototyping, trials and systems deployment and focus on value-added application and services.

These advances have poised the company as a key partner in enabling ADAS, electric vehicles, factory automation, machine vision, and industrial power management.

The strategic focus of ON Semiconductor automotive and IoT solutions matched with the innovative solutions from startups in Plug and Play’s portfolio sets the company up to take advantage of fast moving industry megatrends.

“Being able to connect startups with corporations that can validate their technology in the market is a game changer,” said Sobhan Khani, vice president of Plug and Play’s IoT and Mobility programs. “ON Semiconductor’s participation in both our Mobility and IoT platform is hugely beneficial to the startups in our ecosystem, we are excited to have them join our ecosystem to move towards a more technologically advanced future.”

Check Also

Digital twins: helping companies plan for the future

Outside of fantasy novels, nobody has a crystal ball to see into the future. However, …

Managing tolerance creep in micro-moulding

Paul Runyan looks at what factors can cause tolerance creep when moulding precise miniaturised parts …

Hydroformed diaphragm valve bodies are the sustainable way

In process manufacturing applications including pharmaceutical as well as food and beverage production, diaphragm valves …