Engineer News Network The ultimate online news and information resource for today’s engineer
Toshiba Electronics Europe will be providing details on its new packaging for its 4.5kV class press-pack IEGT (PPI) devices at …
Read More »Toshiba develops 4.5kV press-pack IEGT with improved rupture resistance
Microsemi expands silicon carbide product portfolios
Microsemi Corporation will be expanding its Silicon Carbide (SiC) MOSFET and SiC diode product portfolios early next quarter, including samples …
Read More »Laser fume extraction
Human expertise and artificial intelligence will combine when BOFA showcases its latest innovations in laser fume extraction at the LASYS trade …
Read More »PDM: Matsuura showcase additive manufacturing
Matsuura Machinery Ltd will be exhibiting at Plastics Design & Moulding Event (PDM) on 19th and 20th June at Telford …
Read More »NFPA 2018: E2S Warning Signals launches new visual signalling devices
E2S Warning Signals, the independent manufacturer of audible and visual warning signals, will be launching its new UL approved Division …
Read More »