Home / Electronics / IoT prototyping kits

IoT prototyping kits

Offering flexible platforms with Wi-Fi, Bluetooth and BLE connectivity and PSoC 6 MCUs for IoT development

RS Components has announced availability of two new PSoC 6 prototyping kits from Cypress Semiconductor Corp – the first for Wi-Fi and Bluetooth IoT development and the second for BLE (Bluetooth Low Energy) based IoT applications.

Along with advanced connectivity, the two kits offer a low-cost hardware development platform that enables designs based around the ultra-low-power dual-core-architecture Cypress PSoC 6 microcontroller.


The PSoC 6 MCU integrates built-in security, up to 2MB of flash memory and 1MB of SRAM, together with an Arm Cortex M4 for high-performance tasks and a Cortex-M0+ for low-power tasks, all on a single chip.

The PSoC 6 Wi-Fi-/BT prototyping kit combines the PSoC 6 MCU with industry-leading connectivity via an on-board module hosting the Cypress CYW4343W combo chipset, which provides 802.11b/g/n Wi-Fi and dual-mode Bluetooth 4.1 connectivity.

The kit provides a snap-away form factor, giving developers flexibility to use different peripherals to design and prototype IoT applications.

It also offers Cypress’ industry-leading CapSense capacitive touch sensing technology, as well as a 512MB Quad-SPI NOR flash device, a MicroSD card slot, and a Digilent Pmod interface.

The second offering is the PSoC 6 BLE prototyping kit, which provides the CYBLE-416045-02 EZ-BLE Creator Module (based on the PSoC 63 MCU).

This module is fully certified for Bluetooth 5.0 and provides a programmable turnkey solution for developers to add Bluetooth connectivity to IoT designs. It comes with a royalty-free BLE stack and provides 36 GPIOs in a 14 x 18.5 x 2.00mm package.

The kit is also designed with a snap-away form-factor, which allows the separation of the on-board programmer and debugger (KitProg2) from the target board. It also provides a mikroBUS interface allowing interfacing of the MCU with any of MikroElektronika’s 500+ click boards.

Both kits are shipping now from RS in the EMEA and Asia Pacific regions.

Check Also

Compact thermal imaging camera for faster, clearer, more reliable inspections

Flir launches the C8 thermal imaging camera, a new device set to enhance compact thermal …

650V 3rd generation SiC MOSFETs in compact TOLL package

Toshiba announces the release of three new 650V silicon carbide (SiC) MOSFETs, which incorporate its …

Intelligent 48-channel LED

Diodes Incorporated announces the launch of its new automotive-compliant AL5958Q matrix LED driver. With its 48-channel constant …